Gaku Minamihaba

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Planarization method and planarization apparatus
- Patent number 10,283,383
- Issue date May 7, 2019
- TOSHIBA MEMORY CORPORATION
- Akifumi Gawase
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization method and planarization apparatus
- Patent number 9,144,879
- Issue date Sep 29, 2015
- Kabushiki Kaisha Toshiba
- Akifumi Gawase
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of semiconductor device and polishing apparatus
- Patent number 9,012,246
- Issue date Apr 21, 2015
- Kabushiki Kaisha Toshiba
- Hajime Eda
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,871,644
- Issue date Oct 28, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method and method for fabricating semiconductor device
- Patent number 8,778,802
- Issue date Jul 15, 2014
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,754,433
- Issue date Jun 17, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chemical planarization and chemical planarization apparatus
- Patent number 8,703,004
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method of organic film and method of...
- Patent number 8,685,857
- Issue date Apr 1, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 8,575,030
- Issue date Nov 5, 2013
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,480,915
- Issue date Jul 9, 2013
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- B24 - GRINDING POLISHING
Information Patent Grant
CMP slurry for metallic film, polishing method and method of manufa...
- Patent number 8,337,715
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 8,174,125
- Issue date May 8, 2012
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP treating liquid and manufacturing method of semiconductor...
- Patent number 7,951,717
- Issue date May 31, 2011
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry for metallic film, polishing method and method of manufa...
- Patent number 7,842,191
- Issue date Nov 30, 2010
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aqueous dispersion for CMP, polishing method and method for manufac...
- Patent number 7,833,431
- Issue date Nov 16, 2010
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,825,028
- Issue date Nov 2, 2010
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,700,489
- Issue date Apr 20, 2010
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device fabrication method
- Patent number 7,682,975
- Issue date Mar 23, 2010
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP treating liquid and manufacturing method of semiconductor...
- Patent number 7,655,559
- Issue date Feb 2, 2010
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 7,521,350
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device and polishing method
- Patent number 7,494,931
- Issue date Feb 24, 2009
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,465,668
- Issue date Dec 16, 2008
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry for CMP, polishing method and method of manufacturing semico...
- Patent number 7,459,398
- Issue date Dec 2, 2008
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method of organic film and method of...
- Patent number 7,452,819
- Issue date Nov 18, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,435,682
- Issue date Oct 14, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for CMP, polishing method and method of manufacturing semico...
- Patent number 7,419,910
- Issue date Sep 2, 2008
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for chemically mechanically polishing organic film, method o...
- Patent number 7,402,521
- Issue date Jul 22, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry for CMP and CMP method
- Patent number 7,364,667
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing method and polishing liquid
- Patent number 7,354,861
- Issue date Apr 8, 2008
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for CMP, polishing method and method of manufacturing semico...
- Patent number 7,332,104
- Issue date Feb 19, 2008
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLANARIZATION METHOD AND PLANARIZATION APPARATUS
- Publication number 20150357212
- Publication date Dec 10, 2015
- KABUSHIKI KAISHA TOSHIBA
- Akifumi GAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD AND PLANARIZATION APPARATUS
- Publication number 20140220778
- Publication date Aug 7, 2014
- KABUSHIKI KAISHA TOSHIBA
- Akifumi GAWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS
- Publication number 20140187042
- Publication date Jul 3, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140073136
- Publication date Mar 13, 2014
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MANU...
- Publication number 20140030891
- Publication date Jan 30, 2014
- Kabushiki Kaisha Toshiba
- Susumu YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND POLISHING APPARATUS
- Publication number 20140004628
- Publication date Jan 2, 2014
- Kabushiki Kaisha Toshiba
- Hajime EDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140004775
- Publication date Jan 2, 2014
- Kabushiki Kaisha Toshiba
- Hajime EDA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND CHEMICAL MECHANICAL P...
- Publication number 20130331004
- Publication date Dec 12, 2013
- Gaku MINAMIHABA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130331005
- Publication date Dec 12, 2013
- Kabushiki Kaisha Toshiba
- Akifumi GAWASE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130273817
- Publication date Oct 17, 2013
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS
- Publication number 20130119013
- Publication date May 16, 2013
- Yukiteru MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP METHOD, CMP APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20130095661
- Publication date Apr 18, 2013
- Akifumi Gawase
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130095656
- Publication date Apr 18, 2013
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20130084400
- Publication date Apr 4, 2013
- Masako KODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SLURRY AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130078784
- Publication date Mar 28, 2013
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130040456
- Publication date Feb 14, 2013
- Hajime EDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120258597
- Publication date Oct 11, 2012
- Gaku Minamihaba
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120034846
- Publication date Feb 9, 2012
- Gaku MINAMIHABA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110294291
- Publication date Dec 1, 2011
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECH...
- Publication number 20110250756
- Publication date Oct 13, 2011
- KABUSHIKI KAISHA TOSHIBA
- Kazuhito UCHIKURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CLEANING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20110192420
- Publication date Aug 11, 2011
- Nobuyuki KURASHIMA
- B08 - CLEANING
Information Patent Application
POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20110195888
- Publication date Aug 11, 2011
- Nobuyuki KURASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP slurry for metallic film, polishing method and method of manufa...
- Publication number 20110062374
- Publication date Mar 17, 2011
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20100093585
- Publication date Apr 15, 2010
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20090184415
- Publication date Jul 23, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20090176372
- Publication date Jul 9, 2009
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chemical mechanical polishing method of organic film and method of...
- Publication number 20090068841
- Publication date Mar 12, 2009
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090068840
- Publication date Mar 12, 2009
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of manunfacturing semiconductor device
- Publication number 20090061626
- Publication date Mar 5, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR MANUFACTURING S...
- Publication number 20080227297
- Publication date Sep 18, 2008
- Yukiteru MATSUI
- B24 - GRINDING POLISHING

Gaku Minamihaba

Person

Patents Grantslast 30 patents

Planarization method and planarization apparatus

Planarization method and planarization apparatus

Manufacturing method of semiconductor device and polishing apparatus

Method of manufacturing semiconductor device

Polishing method and method for fabricating semiconductor device

Semiconductor device and method of manufacturing the same

Method for chemical planarization and chemical planarization apparatus

Chemical mechanical polishing method of organic film and method of...

Semiconductor device manufacturing method

Method of manufacturing semiconductor device

CMP slurry for metallic film, polishing method and method of manufa...

Manufacturing method of a semiconductor device

Post-CMP treating liquid and manufacturing method of semiconductor...

CMP slurry for metallic film, polishing method and method of manufa...

Aqueous dispersion for CMP, polishing method and method for manufac...

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

Semiconductor device fabrication method

Post-CMP treating liquid and manufacturing method of semiconductor...

Manufacturing method of a semiconductor device

Method for fabricating semiconductor device and polishing method

Method of manufacturing semiconductor device

Slurry for CMP, polishing method and method of manufacturing semico...

Chemical mechanical polishing method of organic film and method of...

Method of manufacturing semiconductor device

Slurry for CMP, polishing method and method of manufacturing semico...

Method for chemically mechanically polishing organic film, method o...

Slurry for CMP and CMP method

Polishing method and polishing liquid

Slurry for CMP, polishing method and method of manufacturing semico...

Patents Applicationslast 30 patents

PLANARIZATION METHOD AND PLANARIZATION APPARATUS

PLANARIZATION METHOD AND PLANARIZATION APPARATUS

METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MANU...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND POLISHING APPARATUS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND CHEMICAL MECHANICAL P...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR CHEMICAL PLANARIZATION AND CHEMICAL PLANARIZATION APPARATUS

CMP METHOD, CMP APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE PROCESSING METHOD

CMP SLURRY AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECH...

CLEANING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE

POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...

CMP slurry for metallic film, polishing method and method of manufa...

POST-CMP TREATING LIQUID AND MANUFACTURING METHOD OF SEMICONDUCTOR...

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

CHEMICAL MECHANICAL POLISHING SLURRY AND SEMICONDUCTOR DEVICE MANUF...

Chemical mechanical polishing method of organic film and method of...

POLISHING LIQUID AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method of manunfacturing semiconductor device

CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR MANUFACTURING S...