Galen W. Miller

Person

Simpsonville, SC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structural lead frame
- Patent number 11,923,151
- Issue date Mar 5, 2024
- KEMET Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component assemblies and embedding for high density electronics
- Patent number 11,744,018
- Issue date Aug 29, 2023
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,984,955
- Issue date Apr 20, 2021
- KEMET Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a leadless stack comprising multiple components
- Patent number 10,790,094
- Issue date Sep 29, 2020
- KEMET Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Higher density multi-component and serial packages
- Patent number 10,757,811
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- James A. Burk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,707,145
- Issue date Jul 7, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless stack comprising multiple components
- Patent number 10,381,162
- Issue date Aug 13, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component structures with reduced microphonic noise
- Patent number 10,366,836
- Issue date Jul 30, 2019
- Kemet Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bulk MLCC capacitor module
- Patent number 10,224,149
- Issue date Mar 5, 2019
- Kemet Electronics Corporation
- Galen W. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Higher density multi-component and serial packages
- Patent number 10,178,770
- Issue date Jan 8, 2019
- Kemet Electronics Corporation
- James A Burk
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multiple MLCC modules
- Patent number 9,805,872
- Issue date Oct 31, 2017
- Kemet Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structural Lead Frame
- Publication number 20210241977
- Publication date Aug 5, 2021
- Kemet Electronics Corporation
- Galen W. Miller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Assemblies and Embedding for High Density Electronics
- Publication number 20210227693
- Publication date Jul 22, 2021
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20190318877
- Publication date Oct 17, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Electronic Component Structures with Reduced Microphonic Noise
- Publication number 20190304698
- Publication date Oct 3, 2019
- Kemet Electronics Corporation
- John Bultitude
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Higher Density Multi-Component and Serial Packages
- Publication number 20190200457
- Publication date Jun 27, 2019
- Kemet Electronics Corporation
- James A. Burk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190090348
- Publication date Mar 21, 2019
- Kemet Electronics Corporation
- John Bultitude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190080982
- Publication date Mar 14, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Multi-Component Packages
- Publication number 20190082539
- Publication date Mar 14, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20170358397
- Publication date Dec 14, 2017
- Kemet Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple MLCC Modules
- Publication number 20170169955
- Publication date Jun 15, 2017
- Kemet Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bulk MLCC Capacitor Module
- Publication number 20170169956
- Publication date Jun 15, 2017
- Kemet Electronics Corporation
- Galen W. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Structures with Reduced Microphonic Noise
- Publication number 20170025223
- Publication date Jan 26, 2017
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS

Galen W. Miller

Person

Patents Grantslast 30 patents

Structural lead frame

Component assemblies and embedding for high density electronics

Electronic component structures with reduced microphonic noise

Method of forming a leadless stack comprising multiple components

High density multi-component packages

Higher density multi-component and serial packages

High density multi-component packages

High density multi-component packages

Leadless stack comprising multiple components

Electronic component structures with reduced microphonic noise

Bulk MLCC capacitor module

Higher density multi-component and serial packages

Multiple MLCC modules

Patents Applicationslast 30 patents

Structural Lead Frame

Component Assemblies and Embedding for High Density Electronics

Leadless Stack Comprising Multiple Components

Electronic Component Structures with Reduced Microphonic Noise

Higher Density Multi-Component and Serial Packages

High Density Multi-Component Packages

High Density Multi-Component Packages

High Density Multi-Component Packages

Leadless Stack Comprising Multiple Components

Multiple MLCC Modules

Bulk MLCC Capacitor Module

Electronic Component Structures with Reduced Microphonic Noise