Gan Kian Yeow

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of making thermally enhanced substrate-base package
- Patent number 7,741,158
- Issue date Jun 22, 2010
- Unisem (Mauritius) Holdings Limited
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of making thermally enhanced substrate-base package
- Publication number 20070284733
- Publication date Dec 13, 2007
- Advanced Interconnect Technologies Limited, a Corporation of Mauritius.
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS