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Ganesh Vetrivel Periasamy
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
System and method for an electronic package with a fail-open mechanism
Patent number
8,816,390
Issue date
Aug 26, 2014
Infineon Technologies AG
Carlo Baterna Marbella
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
RF and MMIC stackable micro-modules
Patent number
7,592,703
Issue date
Sep 22, 2009
Agency for Science, Technology and Research
Vaidyanathan Kripesh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
RF and MMIC stackable micro-modules
Patent number
7,230,318
Issue date
Jun 12, 2007
Agency for Science, Technology and Research
Vaidyanathan Kripesh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra...
Patent number
7,160,756
Issue date
Jan 9, 2007
Agency for Science, Techology and Research
Vaidyanathan Kripesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for ultra thinning bumped wafers for flip chip
Patent number
7,141,487
Issue date
Nov 28, 2006
Agency for Science Technology and Research
Ganesh Vetrivel Periasamy
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM
Publication number
20130194752
Publication date
Aug 1, 2013
INFINEON TECHNOLOGIES AG
Carlo Baterna Marbella
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF and MMIC stackable micro-modules
Publication number
20070222083
Publication date
Sep 27, 2007
Agency For Science, Technology and Research
Vaidyanathan Kripesh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra...
Publication number
20060079025
Publication date
Apr 13, 2006
Agency For Science, Technology and Research
Vaidyanathan Kripesh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for ultra thinning bumped wafers for flip chip
Publication number
20060003550
Publication date
Jan 5, 2006
Agency For Science, Technology and Research
Ganesh Vetrivel Periasamy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF and MMIC stackable micro-modules
Publication number
20050146049
Publication date
Jul 7, 2005
Agency For Science, Technology and Research
Vaidyanathan Kripesh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR