GAO-MING WU

Person

HSINCHU, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,362,291
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated structure and manufacturing method the...
- Patent number 12,148,691
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned multilayer spacer matrix for high-density transistor a...
- Patent number 12,137,573
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Gao-Ming Wu
Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,068,380
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity in metal interconnect structure
- Patent number 11,984,351
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,848,332
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gao-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an active component and a barrier pa...
- Patent number 11,695,039
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,257,861
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Gao-Ming Wu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method
- Publication number 20250105172
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES
- Publication number 20250105185
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE
- Publication number 20250029918
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED MULTILAYER SPACER MATRIX FOR HIGH-DENSITY TRANSISTOR A...
- Publication number 20240383048
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Gao-Ming WU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240363706
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240079497
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240055371
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY IN METAL INTERCONNECT STRUCTURE
- Publication number 20230369107
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20230307351
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED MULTILAYER SPACER MATRIX FOR HIGH-DENSITY TRANSISTOR A...
- Publication number 20230189533
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gao-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230141313
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL FIELD EFFECT TRANSISTORS AND METHODS FOR FORMING THE SAME
- Publication number 20230138939
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gao-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230032528
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230028561
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gao-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY IN METAL INTERCONNECT STRUCTURE
- Publication number 20220328346
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210375985
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- GAO-MING WU
- H01 - BASIC ELECTRIC ELEMENTS

GAO-MING WU

Person

Patents Grantslast 30 patents

Semiconductor device and method

Three-dimensional integrated structure and manufacturing method the...

Self-aligned multilayer spacer matrix for high-density transistor a...

Semiconductor structures and methods of forming the same

Cavity in metal interconnect structure

Semiconductor device and manufacturing method thereof

Semiconductor device including an active component and a barrier pa...

Semiconductor structure and method of forming the same

Patents Applicationslast 30 patents

Semiconductor Device and Method

ARRANGING BOND PADS TO REDUCE IMPACT ON PASSIVE DEVICES

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE

SELF-ALIGNED MULTILAYER SPACER MATRIX FOR HIGH-DENSITY TRANSISTOR A...

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

TRANSISTOR STRUCTURE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

CAVITY IN METAL INTERCONNECT STRUCTURE

THREE-DIMENSIONAL INTEGRATED STRUCTURE AND MANUFACTURING METHOD THE...

SELF-ALIGNED MULTILAYER SPACER MATRIX FOR HIGH-DENSITY TRANSISTOR A...

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

VERTICAL FIELD EFFECT TRANSISTORS AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CAVITY IN METAL INTERCONNECT STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME