Garrett H. Sin

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for profile and surface preparation of retain...
- Patent number 11,241,769
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- David Masayuki Ishikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Process development visualization tool
- Patent number 11,157,661
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Vinayak Veer Vats
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polishing system with local area rate control and oscillation mode
- Patent number 10,610,994
- Issue date Apr 7, 2020
- Applied Materials, Inc.
- Eric Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selection of polishing parameters to generate removal or pressure p...
- Patent number 10,493,590
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Local area polishing system and polishing pad assemblies for a poli...
- Patent number 10,434,623
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for profile and surface preparation of retain...
- Patent number 10,252,397
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- David Masayuki Ishikawa
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for small pad for chemical mechanical polishing
- Patent number 9,873,179
- Issue date Jan 23, 2018
- Applied Materials, Inc.
- Hui Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Selection of polishing parameters to generate removal or pressure p...
- Patent number 9,213,340
- Issue date Dec 15, 2015
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Selection of polishing parameters to generate removal profile
- Patent number 8,774,958
- Issue date Jul 8, 2014
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
In-line wafer thickness sensing
- Patent number 8,628,376
- Issue date Jan 14, 2014
- Applied Materials, Inc.
- Garrett H. Sin
- B24 - GRINDING POLISHING
Information Patent Grant
Post CMP scrubbing of substrates
- Patent number 8,372,210
- Issue date Feb 12, 2013
- Applied Materials, Inc.
- Garrett H. Sin
- B08 - CLEANING
Information Patent Grant
Vapor dryer having hydrophilic end effector
- Patent number 8,205,352
- Issue date Jun 26, 2012
- Applied Materials, Inc.
- John S. Lewis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Vapor dryer having hydrophilic end effector
- Patent number 7,980,000
- Issue date Jul 19, 2011
- Applied Materials, Inc.
- John S. Lewis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
INTERLOCKED STEPPED RETAINING RING
- Publication number 20230023915
- Publication date Jan 26, 2023
- Applied Materials, Inc.
- Thomas Lawrence TERRY
- B24 - GRINDING POLISHING
Information Patent Application
PROCESS DEVELOPMENT VISUALIZATION TOOL
- Publication number 20200202044
- Publication date Jun 25, 2020
- Applied Materials, Inc.
- Vinayak Veer Vats
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...
- Publication number 20190105754
- Publication date Apr 11, 2019
- Applied Materials, Inc.
- David Masayuki ISHIKAWA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL AND OSCILLATION MODE
- Publication number 20170274495
- Publication date Sep 28, 2017
- Applied Materials, Inc.
- Eric LAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL AREA POLISHING SYSTEM AND POLISHING PAD ASSEMBLIES FOR A POLI...
- Publication number 20170274497
- Publication date Sep 28, 2017
- Applied Materials, Inc.
- Eric LAU
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER FOR SMALL PAD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20170203405
- Publication date Jul 20, 2017
- Applied Materials, Inc.
- Hui Chen
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...
- Publication number 20160121453
- Publication date May 5, 2016
- Applied Materials, Inc.
- David Masayuki ISHIKAWA
- B24 - GRINDING POLISHING
Information Patent Application
Selection of Polishing Parameters to Generate Removal or Pressure P...
- Publication number 20160096251
- Publication date Apr 7, 2016
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Selection of Polishing Parameters to Generate Removal or Pressure P...
- Publication number 20140277670
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Huanbo Zhang
- B24 - GRINDING POLISHING
Information Patent Application
POST CMP SCRUBBING OF SUBSTRATES
- Publication number 20130139851
- Publication date Jun 6, 2013
- Applied Materials, Inc.
- Garrett H. Sin
- B08 - CLEANING
Information Patent Application
VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR
- Publication number 20110266736
- Publication date Nov 3, 2011
- JOHN S. LEWIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Line Wafer Thickness Sensing
- Publication number 20100120333
- Publication date May 13, 2010
- Applied Materials, Inc.
- Garrett H. Sin
- B24 - GRINDING POLISHING
Information Patent Application
VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR
- Publication number 20090084413
- Publication date Apr 2, 2009
- APPLIED MATERIALS, INC.
- JOHN S. LEWIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST CMP SCRUBBING OF SUBSTRATES
- Publication number 20090031512
- Publication date Feb 5, 2009
- APPLIED MATERIALS, INC.
- Garrett H. Sin
- B08 - CLEANING
Information Patent Application
DETECTION OF CLEARANCE OF POLYSILICON RESIDUE
- Publication number 20080138988
- Publication date Jun 12, 2008
- Jeffrey Drue David
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and compositions for chemical mechanical polishing substrates
- Publication number 20060088999
- Publication date Apr 27, 2006
- APPLIED MATERIALS, INC.
- Garrett H. Sin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods and compositions for chemical mechanical polishing substrates
- Publication number 20060088976
- Publication date Apr 27, 2006
- APPLIED MATERIALS, INC.
- Garrett H. Sin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Post CMP scrubbing of substrates
- Publication number 20050109371
- Publication date May 26, 2005
- APPLIED MATERIALS, INC.
- Garrett H. Sin
- B08 - CLEANING

Garrett H. Sin

Person

Patents Grantslast 30 patents

Methods and apparatus for profile and surface preparation of retain...

Process development visualization tool

Polishing system with local area rate control and oscillation mode

Selection of polishing parameters to generate removal or pressure p...

Local area polishing system and polishing pad assemblies for a poli...

Methods and apparatus for profile and surface preparation of retain...

Carrier for small pad for chemical mechanical polishing

Selection of polishing parameters to generate removal or pressure p...

Selection of polishing parameters to generate removal profile

In-line wafer thickness sensing

Post CMP scrubbing of substrates

Vapor dryer having hydrophilic end effector

Vapor dryer having hydrophilic end effector

Patents Applicationslast 30 patents

INTERLOCKED STEPPED RETAINING RING

PROCESS DEVELOPMENT VISUALIZATION TOOL

METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...

POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL AND OSCILLATION MODE

LOCAL AREA POLISHING SYSTEM AND POLISHING PAD ASSEMBLIES FOR A POLI...

CARRIER FOR SMALL PAD FOR CHEMICAL MECHANICAL POLISHING

METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAIN...

Selection of Polishing Parameters to Generate Removal or Pressure P...

Selection of Polishing Parameters to Generate Removal or Pressure P...

POST CMP SCRUBBING OF SUBSTRATES

VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR

In-Line Wafer Thickness Sensing

VAPOR DRYER HAVING HYDROPHILIC END EFFECTOR

POST CMP SCRUBBING OF SUBSTRATES

DETECTION OF CLEARANCE OF POLYSILICON RESIDUE

Methods and compositions for chemical mechanical polishing substrates

Methods and compositions for chemical mechanical polishing substrates

Post CMP scrubbing of substrates