Gary A. Humbert

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Geneva, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
High-density, robust connector for stacking applications
- Patent number 7,621,779
- Issue date Nov 24, 2009
- Molex Incorporated
- John C. Laurx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density, robust connector with castellations
- Patent number 7,320,621
- Issue date Jan 22, 2008
- Molex Incorporated
- John C. Laurx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density connector assembly with flexural capabilities
- Patent number 6,979,215
- Issue date Dec 27, 2005
- Molex Incorporated
- Hazelton P. Avery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interstitial ground assembly for connector
- Patent number 6,746,278
- Issue date Jun 8, 2004
- Molex Incorporated
- Richard A. Nelson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High-density, robust connector with castellations
- Publication number 20070021001
- Publication date Jan 25, 2007
- John C. Laurx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-density, robust connector for stacking applications
- Publication number 20070021003
- Publication date Jan 25, 2007
- John C. Laurx
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-density connector assembly with flexural capabilities
- Publication number 20030124881
- Publication date Jul 3, 2003
- Hazelton P. Avery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interstitial ground assembly for connecctor
- Publication number 20030119362
- Publication date Jun 26, 2003
- Richard A. Nelson
- H01 - BASIC ELECTRIC ELEMENTS