Gary Baxter Long

Person

Aloha, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect architecture with stacked flex cable
- Patent number 9,332,643
- Issue date May 3, 2016
- Intel Corporation
- Sanka Ganesan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a fiber reinforced printed circuit board panel and...
- Patent number 8,307,548
- Issue date Nov 13, 2012
- Intel Corporation
- William O. Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-ground plane partitioning and via connection to utilize chann...
- Patent number 8,299,369
- Issue date Oct 30, 2012
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-ground plane partitioning and via connection to utilize chann...
- Patent number 8,056,221
- Issue date Nov 15, 2011
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a fiber reinforced printed circuit board panel and...
- Patent number 7,843,057
- Issue date Nov 30, 2010
- Intel Corporation
- William O. Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of power-ground plane partitioning to utilize channel/trenches
- Patent number 7,797,826
- Issue date Sep 21, 2010
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting a component with an embedded optical fiber
- Patent number 7,630,601
- Issue date Dec 8, 2009
- Intel Corporation
- Jayne L. Mershon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting a component with an embedded optical fiber
- Patent number 7,373,068
- Issue date May 13, 2008
- Intel Corporation
- Jayne L. Mershon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for an embedded air dielectric for a package a...
- Patent number 7,361,842
- Issue date Apr 22, 2008
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor trace design to reduce common mode cross-talk and timing...
- Patent number 7,343,576
- Issue date Mar 11, 2008
- Intel Corporation
- Gary A. Brist
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for creating power-ground plane partitioning and via connect...
- Patent number 7,269,899
- Issue date Sep 18, 2007
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical socket with compressible domed contacts
- Patent number 7,234,947
- Issue date Jun 26, 2007
- Intel Corporation
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-thermal induced diffusion
- Patent number 7,145,243
- Issue date Dec 5, 2006
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical socket with compressible domed contacts
- Patent number 7,121,841
- Issue date Oct 17, 2006
- Intel Corporation
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-thermal induced diffusion
- Patent number 7,064,063
- Issue date Jun 20, 2006
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor trace design to reduce common mode cross-talk and timing...
- Patent number 7,043,706
- Issue date May 9, 2006
- Intel Corporation
- Gary A. Brist
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board trace routing method
- Patent number 7,022,919
- Issue date Apr 4, 2006
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power delivery apparatus, systems, and methods
- Patent number 6,992,899
- Issue date Jan 31, 2006
- Intel Corporation
- William Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array socket with a dedicated power/ground conductor bus
- Patent number 6,916,183
- Issue date Jul 12, 2005
- Intel Corporation
- William O. Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waveguide in a printed circuit board and method of forming the same
- Patent number 6,882,762
- Issue date Apr 19, 2005
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-ground plane partitioning and via connection to utilize chann...
- Patent number 6,747,216
- Issue date Jun 8, 2004
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photo-thermal induced diffusion
- Patent number 6,642,158
- Issue date Nov 4, 2003
- Intel Corporation
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE
- Publication number 20160248210
- Publication date Aug 25, 2016
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE
- Publication number 20140273552
- Publication date Sep 18, 2014
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A FIBER REINFORCED PRINTED CIRCUIT BOARD PANEL AND...
- Publication number 20100328919
- Publication date Dec 30, 2010
- William O. Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power-Ground Plane Partitioning and Via Connection to Utilize Chann...
- Publication number 20100038127
- Publication date Feb 18, 2010
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connecting a component with an embedded optical fiber
- Publication number 20080159689
- Publication date Jul 3, 2008
- Jayne L. Mershon
- G02 - OPTICS
Information Patent Application
Power-ground plane partitioning and via connection to utilize chann...
- Publication number 20080029295
- Publication date Feb 7, 2008
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power-ground plane partitioning and via connection to utilize chann...
- Publication number 20080029296
- Publication date Feb 7, 2008
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making a fiber reinforced printed circuit board panel and...
- Publication number 20070110388
- Publication date May 17, 2007
- Intel Corporation
- William O. Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Built up printed circuit boards
- Publication number 20070037432
- Publication date Feb 15, 2007
- Jayne L. Mershon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING A COMPONENT WITH AN EMBEDDED OPTICAL FIBER
- Publication number 20070025667
- Publication date Feb 1, 2007
- Jayne L. Mershon
- G02 - OPTICS
Information Patent Application
Apparatus and method for an embedded air dielectric for a package a...
- Publication number 20070000687
- Publication date Jan 4, 2007
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical socket with compressible domed contacts
- Publication number 20060258184
- Publication date Nov 16, 2006
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor trace design to reduce common mode cross-talk and timing...
- Publication number 20060123371
- Publication date Jun 8, 2006
- Gary A. Brist
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electrical socket with compressible domed contacts
- Publication number 20060099835
- Publication date May 11, 2006
- William O. Alger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming electrical connections and resulting devices
- Publication number 20050208749
- Publication date Sep 22, 2005
- Michael W. Beckman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Connecting a component with an embedded optical fiber
- Publication number 20050063637
- Publication date Mar 24, 2005
- Jayne L. Mershon
- G02 - OPTICS
Information Patent Application
Optical fibers embedded in a printed circuit board
- Publication number 20050063638
- Publication date Mar 24, 2005
- William O. Alger
- G02 - OPTICS
Information Patent Application
Printed circuit board trace routing method
- Publication number 20040262036
- Publication date Dec 30, 2004
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power delivery apparatus, systems, and methods
- Publication number 20040184248
- Publication date Sep 23, 2004
- Intel Corporation
- William Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor trace design to reduce common mode cross-talk and timing...
- Publication number 20040181764
- Publication date Sep 16, 2004
- Gary A. Brist
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Array socket with a dedicated power/ground conductor bus
- Publication number 20040175966
- Publication date Sep 9, 2004
- William O. Alger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photo-thermal induced diffusion
- Publication number 20040058561
- Publication date Mar 25, 2004
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photo-thermal induced diffusion
- Publication number 20040058521
- Publication date Mar 25, 2004
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power-ground plane partitioning and via connection to utilize chann...
- Publication number 20030205407
- Publication date Nov 6, 2003
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power-ground plane partitioning and via connection to utilize chann...
- Publication number 20030146020
- Publication date Aug 7, 2003
- Gary A. Brist
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Waveguide in a printed circuit board and method of forming the same
- Publication number 20030059151
- Publication date Mar 27, 2003
- Gary A. Brist
- H01 - BASIC ELECTRIC ELEMENTS

Gary Baxter Long

Person

Patents Grantslast 30 patents

Interconnect architecture with stacked flex cable

Method of making a fiber reinforced printed circuit board panel and...

Power-ground plane partitioning and via connection to utilize chann...

Power-ground plane partitioning and via connection to utilize chann...

Method of making a fiber reinforced printed circuit board panel and...

Method of power-ground plane partitioning to utilize channel/trenches

Connecting a component with an embedded optical fiber

Connecting a component with an embedded optical fiber

Apparatus and method for an embedded air dielectric for a package a...

Conductor trace design to reduce common mode cross-talk and timing...

Method for creating power-ground plane partitioning and via connect...

Electrical socket with compressible domed contacts

Photo-thermal induced diffusion

Electrical socket with compressible domed contacts

Photo-thermal induced diffusion

Conductor trace design to reduce common mode cross-talk and timing...

Printed circuit board trace routing method

Power delivery apparatus, systems, and methods

Array socket with a dedicated power/ground conductor bus

Waveguide in a printed circuit board and method of forming the same

Power-ground plane partitioning and via connection to utilize chann...

Photo-thermal induced diffusion

Patents Applicationslast 30 patents

INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE

INTERCONNECT ARCHITECTURE WITH STACKED FLEX CABLE

METHOD OF MAKING A FIBER REINFORCED PRINTED CIRCUIT BOARD PANEL AND...

Power-Ground Plane Partitioning and Via Connection to Utilize Chann...

Connecting a component with an embedded optical fiber

Power-ground plane partitioning and via connection to utilize chann...

Power-ground plane partitioning and via connection to utilize chann...

Method of making a fiber reinforced printed circuit board panel and...

Built up printed circuit boards

CONNECTING A COMPONENT WITH AN EMBEDDED OPTICAL FIBER

Apparatus and method for an embedded air dielectric for a package a...

Electrical socket with compressible domed contacts

Conductor trace design to reduce common mode cross-talk and timing...

Electrical socket with compressible domed contacts

Methods for forming electrical connections and resulting devices

Connecting a component with an embedded optical fiber

Optical fibers embedded in a printed circuit board

Printed circuit board trace routing method

Power delivery apparatus, systems, and methods

Conductor trace design to reduce common mode cross-talk and timing...

Array socket with a dedicated power/ground conductor bus

Photo-thermal induced diffusion

Photo-thermal induced diffusion

Power-ground plane partitioning and via connection to utilize chann...

Power-ground plane partitioning and via connection to utilize chann...

Waveguide in a printed circuit board and method of forming the same