Gary C. Johnson

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having corrugated leads and method for forming
- Patent number 10,134,660
- Issue date Nov 20, 2018
- NXP USA, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die lead frame packaging
- Patent number 9,397,082
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- William E. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple die lead frame
- Patent number 9,236,331
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- William E. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing same
- Patent number 6,967,390
- Issue date Nov 22, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Gary Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device package and method
- Patent number 5,969,461
- Issue date Oct 19, 1999
- CTS Corporation
- Michael J. Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of making a microelectronic device package
- Patent number 5,928,598
- Issue date Jul 27, 1999
- Motorola, Inc.
- Michael John Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Saw device package and method
- Patent number 5,892,417
- Issue date Apr 6, 1999
- Motorola Inc.
- Gary Carl Johnson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave filter package lid attachment apparatus and method ut...
- Patent number 5,729,185
- Issue date Mar 17, 1998
- Motorola Inc.
- Gary Carl Johnson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic device package and method
- Patent number 5,702,775
- Issue date Dec 30, 1997
- Motorola, Inc.
- Michael John Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Lead frame assembly for surface mount integrated circuit power package
- Patent number 5,587,883
- Issue date Dec 24, 1996
- Motorola, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING CORRUGATED LEADS AND METHOD FOR FORMING
- Publication number 20180277464
- Publication date Sep 27, 2018
- NXP USA, Inc.
- JINBANG TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE LEAD FRAME PACKAGING
- Publication number 20160118373
- Publication date Apr 28, 2016
- FREESCALE SEMICONDUCTOR, INC.
- William E. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE LEAD FRAME
- Publication number 20150243588
- Publication date Aug 27, 2015
- FREESCALE SEMICONDUCTOR, INC.
- William E. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and method of manufacturing same
- Publication number 20040159916
- Publication date Aug 19, 2004
- MOTOROLA, INC.
- Gary Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Gary C. Johnson

Person

Patents Grantslast 30 patents

Semiconductor device having corrugated leads and method for forming

Multiple die lead frame packaging

Multiple die lead frame

Electronic component and method of manufacturing same

Surface acoustic wave device package and method

Method of making a microelectronic device package

Saw device package and method

Acoustic wave filter package lid attachment apparatus and method ut...

Microelectronic device package and method

Lead frame assembly for surface mount integrated circuit power package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING CORRUGATED LEADS AND METHOD FOR FORMING

MULTIPLE DIE LEAD FRAME PACKAGING

MULTIPLE DIE LEAD FRAME

Electronic component and method of manufacturing same