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Gary E. Williams
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Short Hills, NJ, US
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last 30 patents
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Patent Grant
Electronic component encapsulated with a composition comprising a p...
Patent number
4,720,424
Issue date
Jan 19, 1988
Hoebbst Celanese Corporation
Nancy C. Eickman
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Encapsulation of electronic components
Patent number
4,719,250
Issue date
Jan 12, 1988
Hoechst Celanese Corporation
Nancy C. Eickman
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Encapsulation of electronic components with anisotropic thermoplast...
Patent number
4,632,798
Issue date
Dec 30, 1986
Celanese Corporation
Nancy C. Eickman
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...