Gary H. Irish

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Jericho, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Planarized plastic package modules for integrated circuits
- Patent number 6,603,195
- Issue date Aug 5, 2003
- International Business Machines Corporation
- David V. Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having contact pads defined by a polymer insulating film
- Patent number 5,776,801
- Issue date Jul 7, 1998
- International Business Machines Corporation
- James L. Carper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having contact pads defined by a polymer insulating film
- Patent number 5,608,260
- Issue date Mar 4, 1997
- International Business Machines Corporation
- James L. Carper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor chip module and method of forming the same
- Patent number 5,585,600
- Issue date Dec 17, 1996
- International Business Machines Corporation
- Francis E. Froebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarized thin film surface covered wire bonded semiconductor package
- Patent number 5,151,559
- Issue date Sep 29, 1992
- International Business Machines Corporation
- H. Ward Conru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a planarized thin film covered wire bonded semicon...
- Patent number 5,086,018
- Issue date Feb 4, 1992
- International Business Machines Corporation
- H. Ward Conru
- H01 - BASIC ELECTRIC ELEMENTS