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Gary Hamm

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  • Medford, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Low internal stress copper electroplating method
    • Patent number 9,493,886
    • Issue date Nov 15, 2016
    • Rohm and Haas Electronic Materials LLC
    • George R. Allardyce
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electrochemical etching of semiconductors
    • Patent number 9,076,657
    • Issue date Jul 7, 2015
    • Rohm and Haas Electronic Materials LLC
    • Gary Hamm
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Grant

    Electrochemical etching of semiconductors
    • Patent number 8,603,314
    • Issue date Dec 10, 2013
    • Rohm and Haas Electronic Materials LLC
    • Gary Hamm
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Grant

    Enhanced method of forming nickel silicides
    • Patent number 7,955,978
    • Issue date Jun 7, 2011
    • Rohm and Hass Electronic Materials LLC
    • John P. Cahalen
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method of light induced plating on semiconductors
    • Patent number 7,955,977
    • Issue date Jun 7, 2011
    • Rohm and Haas Electronic Materials LLC
    • Gary Hamm
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method of inhibiting background plating
    • Patent number 7,939,438
    • Issue date May 10, 2011
    • Rohm and Haas Electronic Materials LLC
    • Gary Hamm
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Grant

    Bath analysis
    • Patent number 7,384,535
    • Issue date Jun 10, 2008
    • Rohm and Haas Electronic Materials LLC
    • Wade Sonnenberg
    • G01 - MEASURING TESTING

Patents Applicationslast 30 patents

  • Information Patent Application

    PLATING OF COPPER ON SEMICONDUCTORS
    • Publication number 20140174936
    • Publication date Jun 26, 2014
    • Rohm and Haas Electronic Materials L.L.C.
    • Gary Hamm
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHOD OF METAL PLATING SEMICONDUCTORS
    • Publication number 20140008234
    • Publication date Jan 9, 2014
    • Rohm and Haas Electronic Materials L.L.C.
    • Lingyun WEI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ELECTROCHEMICAL ETCHING OF SEMICONDUCTORS
    • Publication number 20130288476
    • Publication date Oct 31, 2013
    • Gary HAMM
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METAL PLATING FOR PH SENSITIVE APPLICATIONS
    • Publication number 20130264214
    • Publication date Oct 10, 2013
    • Rohm and Haas Electronic Materials L.L.C.
    • Gary Hamm
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    LOW INTERNAL STRESS COPPER ELECTROPLATING METHOD
    • Publication number 20130240368
    • Publication date Sep 19, 2013
    • Rohm and Haas Electronic Material LLC
    • George R. Allardyce
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ACTIVATION PROCESS TO IMPROVE METAL ADHESION
    • Publication number 20130203252
    • Publication date Aug 8, 2013
    • Rohm and Haas Electronic Materials L.L.C.
    • Lingyun WEI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROCHEMICAL ETCHING OF SEMICONDUCTORS
    • Publication number 20120184098
    • Publication date Jul 19, 2012
    • Rohm and Haas Electronic Materials L.L.C.
    • Gary Hamm
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    ENHANCED METHOD OF FORMING NICKEL SILICIDES
    • Publication number 20110065274
    • Publication date Mar 17, 2011
    • Rohm and Haas Electronic Materials L.L.C.
    • John P. CAHALEN
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Method of light induced plating on semiconductors
    • Publication number 20100003817
    • Publication date Jan 7, 2010
    • Rohm and Haas Electronic Materials L.L.C.
    • Gary Hamm
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Method of inhibiting background plating
    • Publication number 20090258491
    • Publication date Oct 15, 2009
    • Rohm and Haas Electronic Materials L.L.C.
    • Gary Hamm
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Analysis method
    • Publication number 20060151327
    • Publication date Jul 13, 2006
    • Rohm and Haas Electronic Materials, L.L.C.
    • Wade Sonnenberg
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Reverse pulse plating composition and method
    • Publication number 20060081475
    • Publication date Apr 20, 2006
    • Shipley Company, L.L.C.
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Reverse pulse plating composition and method
    • Publication number 20050016858
    • Publication date Jan 27, 2005
    • Shipley Company, L.L.C.
    • Leon R. Barstad
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Bath analysis
    • Publication number 20050016856
    • Publication date Jan 27, 2005
    • Rohm and Haas Electronic Materials, L.L.C.
    • Wade Sonnenberg
    • G01 - MEASURING TESTING