Gary L. Anderson

Follow

Person

St. Ann, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of estimating post-polishing waviness characteristics of a s...
- Patent number 6,613,591
- Issue date Sep 2, 2003
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus to place wafers into and out of machine
- Patent number 6,398,631
- Issue date Jun 4, 2002
- MEMC Electronic Materials, Inc.
- Gary L. Anderson
- B24 - GRINDING POLISHING
Information Patent Grant
Process for fabricating semiconductor wafers with external gettering
- Patent number 6,338,805
- Issue date Jan 15, 2002
- MEMC Electronic Materials, Inc.
- Gary L. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for use in cleaning wafers
- Patent number 5,974,680
- Issue date Nov 2, 1999
- MEMC Electronic Materials, Inc.
- Gary L. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Box handling apparatus and method
- Patent number 5,894,711
- Issue date Apr 20, 1999
- MEMC Electronic Materials, Inc.
- James P. Davidson
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ESTIMATING POST-POLISHING WAVINESS CHARACTERISTICS OF A S...
- Publication number 20030170920
- Publication date Sep 11, 2003
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING