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Gary W. Andrews
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Dallas, TX, US
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last 30 patents
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Patent Grant
Retractable probe system with in situ fabrication environment proce...
Patent number
5,746,835
Issue date
May 5, 1998
Texas Instruments Incorporated
Terry R. Turner
G01 - MEASURING TESTING
Information
Patent Grant
Retractable probe system with in situ fabrication environment proce...
Patent number
5,716,878
Issue date
Feb 10, 1998
Texas Instruments Incorporated
Terry R. Turner
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus and method for flip-chip bonding
Patent number
5,460,320
Issue date
Oct 24, 1995
Texas Instruments Incorporated
James F. Belcher
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Apparatus and method for flip-chip bonding
Patent number
5,370,301
Issue date
Dec 6, 1994
Texas Instruments Incorporated
James F. Belcher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for flip-clip bonding
Patent number
5,351,876
Issue date
Oct 4, 1994
Texas Instruments Incorporated
James F. Belcher
H01 - BASIC ELECTRIC ELEMENTS