Gaurav Chawla

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Deployment orchestrator in a cloud based service for customer enter...
- Patent number 12,293,179
- Issue date May 6, 2025
- Splunk Inc.
- Krishnan Ananthesweran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Autoscaling in a stateful system
- Patent number 12,020,077
- Issue date Jun 25, 2024
- Splunk Inc.
- Sumeet Rohatgi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Generating a modified component for a data intake and query system...
- Patent number 11,922,222
- Issue date Mar 5, 2024
- Splunk Inc.
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic package communication using radio interfaces connec...
- Patent number 11,525,970
- Issue date Dec 13, 2022
- Intel Corporation
- Shawna Liff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package communication using radio interfaces connec...
- Patent number 10,852,495
- Issue date Dec 1, 2020
- Intel Corporation
- Shawna Liff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced capacitance land pad
- Patent number 10,433,421
- Issue date Oct 1, 2019
- Intel Corporation
- Zhichao Zhang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Socket contact techniques and configurations
- Patent number 10,205,292
- Issue date Feb 12, 2019
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal linear edge connector
- Patent number 10,044,115
- Issue date Aug 7, 2018
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading element and associated techniques and configurations
- Patent number 9,848,510
- Issue date Dec 19, 2017
- Intel Corporation
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket contact techniques and configurations
- Patent number 9,780,510
- Issue date Oct 3, 2017
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable connector
- Patent number 9,640,880
- Issue date May 2, 2017
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations associated with a package load assembly
- Patent number 9,615,483
- Issue date Apr 4, 2017
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-array bottom-side connector using spring bias
- Patent number 9,490,560
- Issue date Nov 8, 2016
- Intel Corporation
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Snap connector for socket assembly and associated techniques and co...
- Patent number 9,478,881
- Issue date Oct 25, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral slide pick and place cover for reduced bent pins in LGA soc...
- Patent number 9,385,444
- Issue date Jul 5, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method
- Patent number 9,385,457
- Issue date Jul 5, 2016
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies with scalable clip-type connectors
- Patent number 9,325,087
- Issue date Apr 26, 2016
- Intel Corporation
- Gaurav Chawla
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit connectors
- Patent number 9,265,170
- Issue date Feb 16, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded sockets for microprocessors and fabrication thereof by ove...
- Patent number 9,178,328
- Issue date Nov 3, 2015
- Intel Corporation
- Joshua D Heppner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and methods with integrated pitch translation
- Patent number 9,017,106
- Issue date Apr 28, 2015
- Intel Corporation
- Joshua D Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip socket including a circular contact pattern
- Patent number 8,961,193
- Issue date Feb 24, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly with integrated pitch translation
- Patent number 8,915,747
- Issue date Dec 23, 2014
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector assembly and method
- Patent number 8,905,794
- Issue date Dec 9, 2014
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNEC...
- Publication number 20210041647
- Publication date Feb 11, 2021
- Intel Corporation
- Shawna LIFF
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNEC...
- Publication number 20200065263
- Publication date Feb 27, 2020
- Intel Corporation
- Shawna LIFF
- G02 - OPTICS
Information Patent Application
REDUCED CAPACITANCE LAND PAD
- Publication number 20190394876
- Publication date Dec 26, 2019
- Intel Corporation
- Zhichao ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET CONTACT TECHNIQUES AND CONFIGURATIONS
- Publication number 20180019558
- Publication date Jan 18, 2018
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal linear edge connector
- Publication number 20170187147
- Publication date Jun 29, 2017
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE CONNECTOR
- Publication number 20160276759
- Publication date Sep 22, 2016
- Intel Corporation
- Donald T. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP CONNECTOR FOR SOCKET ASSEMBLY AND ASSOCIATED TECHNIQUES AND CO...
- Publication number 20160268710
- Publication date Sep 15, 2016
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET CONTACT TECHNIQUES AND CONFIGURATIONS
- Publication number 20160254629
- Publication date Sep 1, 2016
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190716
- Publication date Jun 30, 2016
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190717
- Publication date Jun 30, 2016
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
- Publication number 20160183375
- Publication date Jun 23, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS
- Publication number 20160181714
- Publication date Jun 23, 2016
- Intel Corporation
- GAURAV CHAWLA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY
- Publication number 20160079150
- Publication date Mar 17, 2016
- Intel Corporation
- Gaurav Chawla
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVE...
- Publication number 20160028203
- Publication date Jan 28, 2016
- Joshua D. Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH SCALABLE CLIP-TYPE CONNECTORS
- Publication number 20150280337
- Publication date Oct 1, 2015
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD
- Publication number 20150249298
- Publication date Sep 3, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL SLIDE PICK AND PLACE COVER FOR REDUCED BENT PINS IN LGA SOC...
- Publication number 20150171527
- Publication date Jun 18, 2015
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN
- Publication number 20150162719
- Publication date Jun 11, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONNECTORS
- Publication number 20150118870
- Publication date Apr 30, 2015
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVE...
- Publication number 20150004813
- Publication date Jan 1, 2015
- Joshua D. Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHODS WITH INTEGRATED PITCH TRANSLATION
- Publication number 20140273662
- Publication date Sep 18, 2014
- Joshua D. Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION
- Publication number 20140273555
- Publication date Sep 18, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED CAPACITANCE LAND PAD
- Publication number 20140174808
- Publication date Jun 26, 2014
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN
- Publication number 20140162474
- Publication date Jun 12, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD
- Publication number 20140162475
- Publication date Jun 12, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS

Gaurav Chawla

Person

Patents Grantslast 30 patents

Deployment orchestrator in a cloud based service for customer enter...

Autoscaling in a stateful system

Generating a modified component for a data intake and query system...

Microelectronic package communication using radio interfaces connec...

Reduced capacitance land pad

Microelectronic package communication using radio interfaces connec...

Reduced capacitance land pad

Socket contact techniques and configurations

Universal linear edge connector

Socket loading element and associated techniques and configurations

Socket contact techniques and configurations

Cable connector

Techniques and configurations associated with a package load assembly

Electronic assembly that includes a plurality of electronic packages

Multi-array bottom-side connector using spring bias

Snap connector for socket assembly and associated techniques and co...

Lateral slide pick and place cover for reduced bent pins in LGA soc...

Connector assembly and method

Electronic assemblies with scalable clip-type connectors

Integrated circuit connectors

Shielded sockets for microprocessors and fabrication thereof by ove...

Connector assembly and methods with integrated pitch translation

Chip socket including a circular contact pattern

Connector assembly with integrated pitch translation

Connector assembly and method

Patents Applicationslast 30 patents

MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNEC...

MICROELECTRONIC PACKAGE COMMUNICATION USING RADIO INTERFACES CONNEC...

REDUCED CAPACITANCE LAND PAD

SOCKET CONTACT TECHNIQUES AND CONFIGURATIONS

Universal linear edge connector

CABLE CONNECTOR

SNAP CONNECTOR FOR SOCKET ASSEMBLY AND ASSOCIATED TECHNIQUES AND CO...

SOCKET CONTACT TECHNIQUES AND CONFIGURATIONS

SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES

ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES

SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS

MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS

TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY

SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVE...

ELECTRONIC ASSEMBLIES WITH SCALABLE CLIP-TYPE CONNECTORS

CONNECTOR ASSEMBLY AND METHOD

LATERAL SLIDE PICK AND PLACE COVER FOR REDUCED BENT PINS IN LGA SOC...

CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN

INTEGRATED CIRCUIT CONNECTORS

SHIELDED SOCKETS FOR MICROPROCESSORS AND FABRICATION THEREOF BY OVE...

CONNECTOR ASSEMBLY AND METHODS WITH INTEGRATED PITCH TRANSLATION

CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION

REDUCED CAPACITANCE LAND PAD

CHIP SOCKET INCLUDING A CIRCULAR CONTACT PATTERN

CONNECTOR ASSEMBLY AND METHOD