Gaurav HADA

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Bangalore, IN

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Patents Grantslast 30 patents

Information Patent Grant
Socket interposer for system-in-package (SIP) module qualification...
- Patent number 12,025,971
- Issue date Jul 2, 2024
- Intel Corporation
- Navneet Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FOR MEMORY ON PACKAGE WITH REDUCED THICKNESS
- Publication number 20240334715
- Publication date Oct 3, 2024
- Intel Corporation
- Navneet Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERPOSER FOR SYSTEM-IN-PACKAGE (SIP) MODULE QUALIFICATION...
- Publication number 20230251629
- Publication date Aug 10, 2023
- Intel Corporation
- Navneet SINGH
- G05 - CONTROLLING REGULATING
Information Patent Application
MEMORY MODULE CONNECTOR FOR THIN COMPUTING SYSTEMS
- Publication number 20220077609
- Publication date Mar 10, 2022
- Intel Corporation
- Navneet Kumar SINGH
- H01 - BASIC ELECTRIC ELEMENTS