Gaurav MEHTA

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Electrostatic chuck with reduced current leakage for hybrid laser s...
- Patent number 11,600,492
- Issue date Mar 7, 2023
- Applied Materials, Inc.
- Sai Abhinand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for backside via reveal processing
- Patent number 11,289,387
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Prayudi Lianto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die packages
- Patent number 7,723,833
- Issue date May 25, 2010
- United Test & Assembly Center Ltd.
- Gaurav Mehta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER S...
- Publication number 20230187215
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Sai Abhinand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING
- Publication number 20220037216
- Publication date Feb 3, 2022
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID LASER S...
- Publication number 20210175086
- Publication date Jun 10, 2021
- Applied Materials, Inc.
- Sai Abhinand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Packages
- Publication number 20080054435
- Publication date Mar 6, 2008
- United Test and Assembly Center, Ltd.
- Gaurav MEHTA
- H01 - BASIC ELECTRIC ELEMENTS