Gautham Viswanadam

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Micro-device on glass
- Patent number 8,911,636
- Issue date Dec 16, 2014
- Viswanadam Gautham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integration module having controlled resistivity interc...
- Patent number 8,329,573
- Issue date Dec 11, 2012
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration module with interconnects
- Patent number 7,998,854
- Issue date Aug 16, 2011
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing thereof
- Patent number 7,785,928
- Issue date Aug 31, 2010
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging a semiconductor device
- Patent number 7,344,917
- Issue date Mar 18, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Residue-free solder bumping process
- Patent number 6,759,319
- Issue date Jul 6, 2004
- Institute of Microelectronics
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO-DEVICE ON GLASS
- Publication number 20140054261
- Publication date Feb 27, 2014
- Viswanadam Gautham
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATION MODULE HAVING CONTROLLED RESISTIVITY INTERC...
- Publication number 20110318852
- Publication date Dec 29, 2011
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS
- Publication number 20110278569
- Publication date Nov 17, 2011
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS
- Publication number 20110065215
- Publication date Mar 17, 2011
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device and Method of Manufacturing Thereof
- Publication number 20100144093
- Publication date Jun 10, 2010
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A TRACE EMBEDDED PACKAGE
- Publication number 20070281393
- Publication date Dec 6, 2007
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging a semiconductor device
- Publication number 20070122940
- Publication date May 31, 2007
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Residue-free solder bumping process
- Publication number 20020173134
- Publication date Nov 21, 2002
- Institute of Microelectronics
- Gautham Viswanadam
- H01 - BASIC ELECTRIC ELEMENTS

Gautham Viswanadam

Person

Patents Grantslast 30 patents

Micro-device on glass

Wafer level integration module having controlled resistivity interc...

Wafer level integration module with interconnects

Integrated circuit device and method of manufacturing thereof

Method for packaging a semiconductor device

Residue-free solder bumping process

Patents Applicationslast 30 patents

MICRO-DEVICE ON GLASS

WAFER LEVEL INTEGRATION MODULE HAVING CONTROLLED RESISTIVITY INTERC...

WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS

WAFER LEVEL INTEGRATION MODULE WITH INTERCONNECTS

Integrated Circuit Device and Method of Manufacturing Thereof

METHOD OF FORMING A TRACE EMBEDDED PACKAGE

Method for packaging a semiconductor device

Residue-free solder bumping process