Gay M. Samuelson

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding surface and bonding method
- Patent number 6,265,300
- Issue date Jul 24, 2001
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure having an interposed rigid layer
- Patent number 5,567,981
- Issue date Oct 22, 1996
- Intel Corporation
- Ameet S. Bhansali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated assemblage and method of making
- Patent number 4,869,966
- Issue date Sep 26, 1989
- Shell Oil Company
- Gay M. Samuelson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of making an encapsulated assemblage
- Patent number 4,749,430
- Issue date Jun 7, 1988
- Shell Oil Company
- Gay M. Samuelson
- B32 - LAYERED PRODUCTS
Information Patent Grant
Encapsulated solar cell assemblage and method of making
- Patent number 4,692,557
- Issue date Sep 8, 1987
- Shell Oil Company
- Gay M. Samuelson
- B32 - LAYERED PRODUCTS