Geejagaaru Krishnamurthy Sandesh

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Bangalore, IN

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Patents Grantslast 30 patents

Information Patent Grant
Chip package with staggered pin pattern
- Patent number 11,600,544
- Issue date Mar 7, 2023
- Intel Corporation
- Yogasundaram Chandiran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW PROFILE SODIMM (SMALL OUTLINE DUAL INLINE MEMORY MODULE)
- Publication number 20210321516
- Publication date Oct 14, 2021
- Intel Corporation
- Raghavendra RAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH STAGGERED PIN PATTERN
- Publication number 20200273765
- Publication date Aug 27, 2020
- Intel Corporation
- Yogasundaram Chandiran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR