Gen Sasaki

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Tsuchiura, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper foil for printed circuit board, method for fabricating same,...
- Patent number 7,344,785
- Issue date Mar 18, 2008
- Hitachi Cable, Ltd.
- Muneo Kodaira
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper alloy having improved corrosion resistance, commutator and m...
- Patent number 5,879,476
- Issue date Mar 9, 1999
- Hitachi Cable, Ltd.
- Masahiko Narushima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil
- Publication number 20090173414
- Publication date Jul 9, 2009
- Takemi Muroga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper foil for printed circuit board, method for fabricating same,...
- Publication number 20060257680
- Publication date Nov 16, 2006
- HITACHI CABLE, LTD.
- Muneo Kodaira
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR