Gen Toyota

Person

Oita Oita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,830,847
- Issue date Nov 28, 2023
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,818,501
- Issue date Oct 27, 2020
- TOSHIBA MEMORY CORPORATION
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,935,232
- Issue date Apr 3, 2018
- TOSHIBA MEMORY CORPORATION
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holding mechanism, substrate polishing apparatus and subs...
- Patent number 8,292,694
- Issue date Oct 23, 2012
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding mechanism, substrate polishing apparatus and subs...
- Patent number 7,883,394
- Issue date Feb 8, 2011
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 7,767,472
- Issue date Aug 3, 2010
- Ebara Corporation
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 7,744,445
- Issue date Jun 29, 2010
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding mechanism, substrate polishing apparatus and subs...
- Patent number 7,419,420
- Issue date Sep 2, 2008
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing a substrate
- Patent number 7,241,205
- Issue date Jul 10, 2007
- Kabushiki Kaisha Toshiba
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing a substrate
- Patent number 7,217,662
- Issue date May 15, 2007
- Kabushiki Kaisha Toshiba
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 7,014,529
- Issue date Mar 21, 2006
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240055363
- Publication date Feb 15, 2024
- Kioxia Corporation
- Susumu YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411287
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Eiichi SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230307415
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Satoshi HONGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20230101002
- Publication date Mar 30, 2023
- KIOXIA Corporation
- Gen TOYOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20220375901
- Publication date Nov 24, 2022
- KIOXIA Corporation
- Susumu YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220077106
- Publication date Mar 10, 2022
- KIOXIA Corporation
- Gen TOYOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190362980
- Publication date Nov 28, 2019
- Toshiba Memory Corporation
- Takashi SHIRONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160268469
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20100255757
- Publication date Oct 7, 2010
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBS...
- Publication number 20100062691
- Publication date Mar 11, 2010
- Tetsuji TOGAWA
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and polishing method
- Publication number 20090017730
- Publication date Jan 15, 2009
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBS...
- Publication number 20080318503
- Publication date Dec 25, 2008
- Tetsuji TOGAWA
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20070287364
- Publication date Dec 13, 2007
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Application
Method of processing a substrate
- Publication number 20070178701
- Publication date Aug 2, 2007
- Kabushiki Kaisha Toshiba
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing method and semiconductor device manufacturing...
- Publication number 20070000873
- Publication date Jan 4, 2007
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Application
Substrate holding mechanism, substrate polishing apparatus and subs...
- Publication number 20060205323
- Publication date Sep 14, 2006
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20060019417
- Publication date Jan 26, 2006
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Application
Method of processing a substrate
- Publication number 20050245174
- Publication date Nov 3, 2005
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Application
Method of processing a substrate
- Publication number 20050221615
- Publication date Oct 6, 2005
- Gen Toyota
- B24 - GRINDING POLISHING

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor device and semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Substrate holding mechanism, substrate polishing apparatus and subs...

Substrate holding mechanism, substrate polishing apparatus and subs...

Substrate processing method and substrate processing apparatus

Polishing apparatus and polishing method

Substrate holding mechanism, substrate polishing apparatus and subs...

Method of processing a substrate

Method of processing a substrate

Substrate processing method and substrate processing apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBS...

Polishing apparatus and polishing method

SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBS...

Substrate processing method and substrate processing apparatus

Method of processing a substrate

Substrate processing method and semiconductor device manufacturing...

Substrate holding mechanism, substrate polishing apparatus and subs...

Substrate processing method and substrate processing apparatus

Method of processing a substrate

Method of processing a substrate