Gene Jiing-Chiang Chang

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming die seal structures having substrate trenches
- Patent number 6,300,223
- Issue date Oct 9, 2001
- Winbond Electronics Corp.
- Gene Jiing-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision breaking of semiconductor wafer into chips by applying an...
- Patent number 6,075,280
- Issue date Jun 13, 2000
- Winbond Electronics Corporation
- Hao-Chieh Yung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a die seal
- Patent number 5,891,808
- Issue date Apr 6, 1999
- Winbond Electronics Corp.
- Gene Jiing-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal structure for a semiconductor integrated circuit
- Patent number 5,831,330
- Issue date Nov 3, 1998
- Winbond Electronics Corp.
- Gene Jiing-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a gate-side air-gap structure in a salicide process
- Patent number 5,770,507
- Issue date Jun 23, 1998
- Winbond Electronics Corp.
- Chun-Cho Chen
- H01 - BASIC ELECTRIC ELEMENTS