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Gene Wu
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Dayuan Township, TW
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last 30 patents
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Patent Grant
Enhanced reliability of wafer-level chip-scale packaging (WLCSP) di...
Patent number
7,838,424
Issue date
Nov 23, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Tjandra Winata Karta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging with base layers comprising alloy 42
Patent number
7,830,004
Issue date
Nov 9, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Gene Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ball-mounting method for coplanarity improvement in large package
Patent number
7,642,129
Issue date
Jan 5, 2010
Taiwan Semiconductor Manufacturing Company, Ltd.
Jimmy Liang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Di...
Publication number
20090011543
Publication date
Jan 8, 2009
Tjandra Winata Karta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball-mounting method for coplanarity improvement in large package
Publication number
20080160671
Publication date
Jul 3, 2008
Jimmy Liang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Reverse build-up process for fine bump pitch approach
Publication number
20080131996
Publication date
Jun 5, 2008
Gene Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Packaging with base layers comprising alloy 42
Publication number
20080099912
Publication date
May 1, 2008
Gene Wu
H01 - BASIC ELECTRIC ELEMENTS