Gene Y. Kohara

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,991,157
- Issue date Jun 5, 2018
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a diffusion barrier layer and a metal conduct...
- Patent number 9,390,970
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform barrier layer and metal seed layer w...
- Patent number 8,158,511
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a uniform metal seed layer over a plurality of...
- Patent number 7,989,343
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer over recessed feature surfa...
- Patent number 7,795,138
- Issue date Sep 14, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal / metal nitride barrier layer for semiconductor device applic...
- Patent number 7,687,909
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a sculptured copper seed layer
- Patent number 7,589,016
- Issue date Sep 15, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,381,639
- Issue date Jun 3, 2008
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a tantalum nitride/tantalum diffusion barrier...
- Patent number 7,253,109
- Issue date Aug 7, 2007
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal seed layer on semiconductor substrates
- Patent number 7,074,714
- Issue date Jul 11, 2006
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of preventing diffusion of copper through a tantalum-compris...
- Patent number 6,919,275
- Issue date Jul 19, 2005
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Damage-free sculptured coating deposition
- Patent number 6,758,947
- Issue date Jul 6, 2004
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for shielding a device from a semiconductor wa...
- Patent number 6,620,250
- Issue date Sep 16, 2003
- Applied Materials, Inc.
- Thomas B. Brezoczky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter deposited barrier layers
- Patent number 6,271,592
- Issue date Aug 7, 2001
- Applied Materials, Inc.
- Edwin Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming titanium silicide in situ
- Patent number 6,110,821
- Issue date Aug 29, 2000
- Applied Materials, Inc.
- Gene Y. Kohara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxygen enhancement of ion metal plasma (IMP) sputter deposited barr...
- Patent number 5,985,759
- Issue date Nov 16, 1999
- Applied Materials, Inc.
- Edwin Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...
- Publication number 20160322255
- Publication date Nov 3, 2016
- Applied Materials, Inc.
- Tony CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing a uniform barrier layer and metal seed layer w...
- Publication number 20110256716
- Publication date Oct 20, 2011
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a uniform metal seed layer over a plurality of...
- Publication number 20100255678
- Publication date Oct 7, 2010
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer over recessed feature surfa...
- Publication number 20090269922
- Publication date Oct 29, 2009
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer which provides an im...
- Publication number 20090053888
- Publication date Feb 26, 2009
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a sculptured copper seed layer
- Publication number 20080166869
- Publication date Jul 10, 2008
- APPLIED MATERIALS, INC.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal / metal nitride barrier layer for semiconductor device applic...
- Publication number 20070241458
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damage-free sculptured coating deposition
- Publication number 20070178682
- Publication date Aug 2, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20070020922
- Publication date Jan 25, 2007
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low resistivity barrier layers for copper inte...
- Publication number 20050272254
- Publication date Dec 8, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a tantalum nitride / tantalum diffusion barrie...
- Publication number 20050208767
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a metal seed layer on semiconductor substrates
- Publication number 20050085068
- Publication date Apr 21, 2005
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer and a metal conducti...
- Publication number 20050020080
- Publication date Jan 27, 2005
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of preventing diffusion of copper through a tantalum-compris...
- Publication number 20040171250
- Publication date Sep 2, 2004
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for shielding a device from a semiconductor wa...
- Publication number 20020166632
- Publication date Nov 14, 2002
- APPLIED MATERIALS, INC.
- Thomas B. Brezoczky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damage-free sculptured coating deposition
- Publication number 20020029958
- Publication date Mar 14, 2002
- Applied Materials, Inc.
- Tony Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Gene Y. Kohara

Person

Patents Grantslast 30 patents

Method for depositing a diffusion barrier layer and a metal conduct...

Method for depositing a diffusion barrier layer and a metal conduct...

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Method of depositing a metal seed layer over recessed feature surfa...

Metal / metal nitride barrier layer for semiconductor device applic...

Method of depositing a sculptured copper seed layer

Method of depositing a metal seed layer on semiconductor substrates

Method of depositing a tantalum nitride/tantalum diffusion barrier...

Method of depositing a metal seed layer on semiconductor substrates

Method of preventing diffusion of copper through a tantalum-compris...

Damage-free sculptured coating deposition

Method and apparatus for shielding a device from a semiconductor wa...

Sputter deposited barrier layers

Method for forming titanium silicide in situ

Oxygen enhancement of ion metal plasma (IMP) sputter deposited barr...

Patents Applicationslast 30 patents

METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCT...

Method of depositing a uniform barrier layer and metal seed layer w...

Method of depositing a uniform metal seed layer over a plurality of...

Method of depositing a metal seed layer over recessed feature surfa...

Method of depositing a diffusion barrier layer which provides an im...

Method of depositing a sculptured copper seed layer

Metal / metal nitride barrier layer for semiconductor device applic...

Damage-free sculptured coating deposition

Method of depositing a metal seed layer on semiconductor substrates

Method of depositing low resistivity barrier layers for copper inte...

Method of depositing a tantalum nitride / tantalum diffusion barrie...

Method of depositing a metal seed layer on semiconductor substrates

Method of depositing a diffusion barrier layer and a metal conducti...

Method of preventing diffusion of copper through a tantalum-compris...

Method and apparatus for shielding a device from a semiconductor wa...

Damage-free sculptured coating deposition