Geng-Ming CHANG

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,056,459
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH REDISTRIBUTION LAYER HAVING BONDING POR...
- Publication number 20210335750
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200058614
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS