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Geng Shin Shen
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Tainan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Thermally enhanced electronic package
Patent number
9,307,676
Issue date
Apr 5, 2016
ChipMOS Technologies Inc.
Tzu Hsin Huang
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Conductive structure and method for forming the same
Patent number
9,159,685
Issue date
Oct 13, 2015
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor packaging
Patent number
9,023,727
Issue date
May 5, 2015
ChipMOS Technologies Inc.
Geng Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
QFN package and manufacturing process thereof
Patent number
8,962,395
Issue date
Feb 24, 2015
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive structure and method for forming the same
Patent number
8,872,336
Issue date
Oct 28, 2014
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure of stacking chips and method for manufacturing the same
Patent number
8,809,088
Issue date
Aug 19, 2014
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having no adjacent bumps between two adjace...
Patent number
8,786,082
Issue date
Jul 22, 2014
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging structure
Patent number
8,736,060
Issue date
May 27, 2014
ChipMOS Technologies Inc.
Jun-Yong Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Computer implemented apparatus for generating and filtering creativ...
Patent number
8,712,932
Issue date
Apr 29, 2014
ChipMOS Technologies Inc.
Geng-Shin Shen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Thermally enhanced electronic package
Patent number
8,564,954
Issue date
Oct 22, 2013
ChipMOS Technologies Inc.
Tzu Hsin Huang
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Solder cap bump in semiconductor package and method of manufacturin...
Patent number
8,431,478
Issue date
Apr 30, 2013
ChipMOS Technologies, Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging method involving rearrangement of dice
Patent number
8,431,437
Issue date
Apr 30, 2013
ChipMOS Technologies Inc.
Yu-Ren Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and method for manufacturing the same
Patent number
8,426,255
Issue date
Apr 23, 2013
ChipMOS Technologies, Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging method involving rearrangement of dice
Patent number
8,426,245
Issue date
Apr 23, 2013
ChipMOS Technologies Inc.
Yu-Ren Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automatic creative proposal generating and filtering system and man...
Patent number
8,245,193
Issue date
Aug 14, 2012
ChipMOS Technologies Inc.
Chun-Fang Cheng
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Stacked multichip package
Patent number
8,237,249
Issue date
Aug 7, 2012
ChipMOS Technologies Inc.
Geng Hsin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having bus bar
Patent number
8,212,347
Issue date
Jul 3, 2012
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having inner leads wi...
Patent number
8,207,603
Issue date
Jun 26, 2012
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package structure with leadframe having bus bar
Patent number
8,169,061
Issue date
May 1, 2012
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe for leadless package, structure and manufacturing method...
Patent number
8,105,876
Issue date
Jan 31, 2012
ChipMOS Technologies Inc.
Chun Ying Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Leadframe for leadless package, structure and manufacturing method...
Patent number
8,106,494
Issue date
Jan 31, 2012
ChipMOS Technologies Inc.
Chun Ying Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing packaging structure
Patent number
8,093,106
Issue date
Jan 10, 2012
ChipMOS Technologies Inc.
Jun-Yong Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor structure
Patent number
8,058,109
Issue date
Nov 15, 2011
Chipmos Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabricating process of a chip package structure
Patent number
7,981,725
Issue date
Jul 19, 2011
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package with asymmetric molding
Patent number
7,964,940
Issue date
Jun 21, 2011
ChipMOS Technologies
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
7,960,214
Issue date
Jun 14, 2011
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dice rearrangement package structure using layout process to form a...
Patent number
7,927,922
Issue date
Apr 19, 2011
Chipmos Technologies Inc
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating multi-chip stacked package
Patent number
7,919,358
Issue date
Apr 5, 2011
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die rearrangement package structure using layout process to form a...
Patent number
7,915,690
Issue date
Mar 29, 2011
ChipMOS Technologies Inc.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe for leadless package, structure and manufacturing method...
Patent number
7,902,649
Issue date
Mar 8, 2011
ChipMOS Technologies Inc.
Chun Ying Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20180061811
Publication date
Mar 1, 2018
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20150011082
Publication date
Jan 8, 2015
CHIPMOS TECHNOLOGIES INC.
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGING
Publication number
20140004697
Publication date
Jan 2, 2014
CHIPMOS TECHNOLOGIES INC.
GENG SHIN SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED ELECTRONIC PACKAGE
Publication number
20130294033
Publication date
Nov 7, 2013
TZU HSIN HUANG
B82 - NANO-TECHNOLOGY
Information
Patent Application
QFN Package and Manufacturing Process Thereof
Publication number
20130280865
Publication date
Oct 24, 2013
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE OF STACKING CHIPS AND METHOD FOR MANUFACTURING THE SAME
Publication number
20130249042
Publication date
Sep 26, 2013
CHIPMOS TECHNOLOGIES INC.
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20130147037
Publication date
Jun 13, 2013
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20130127047
Publication date
May 23, 2013
CHIPMOS TECHNOLOGIES INC.
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER CAP BUMP IN SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...
Publication number
20130069231
Publication date
Mar 21, 2013
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20130065361
Publication date
Mar 14, 2013
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QFN PACKAGE AND MANUFACTURING PROCESS THEREOF
Publication number
20120313234
Publication date
Dec 13, 2012
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPUTER IMPLEMENTED APPARATUS FOR GENERATING AND FILTERING CREATIV...
Publication number
20120278789
Publication date
Nov 1, 2012
CHIPMOS TECHNOLOGIES INC.
Geng-Shin SHEN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PACKAGING STRUCTURE
Publication number
20120074402
Publication date
Mar 29, 2012
Jun Yong WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT
Publication number
20120018883
Publication date
Jan 26, 2012
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED ELECTRONIC PACKAGE
Publication number
20110304991
Publication date
Dec 15, 2011
CHIPMOS TECHNOLOGIES INC.
TZU HSIN HUANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Structure
Publication number
20110298124
Publication date
Dec 8, 2011
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method For Manufacturing A Semiconductor Structure
Publication number
20110207262
Publication date
Aug 25, 2011
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE
Publication number
20110183466
Publication date
Jul 28, 2011
Yu-Ren CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dice Rearrangement Package Structure Using Layout Process to Form a...
Publication number
20110163426
Publication date
Jul 7, 2011
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD...
Publication number
20110136299
Publication date
Jun 9, 2011
CHIPMOS TECHNOLOGIES INC.
Chun Ying Lin
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
LEADFRAME FOR LEADLESS PACKAGE, STRUCTURE AND MANUFACTURING METHOD...
Publication number
20110133322
Publication date
Jun 9, 2011
CHIPMOS TECHNOLOGIES INC.
Chun Ying Lin
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20110068455
Publication date
Mar 24, 2011
Jun Yong WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Chip Package Structure with Leadframe Having Inner Leads wi...
Publication number
20100314729
Publication date
Dec 16, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Chip Package Structure with Leadframe Having Bus Bar
Publication number
20100264527
Publication date
Oct 21, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Chip Package Structure with Leadframe Having Bus Bar
Publication number
20100264530
Publication date
Oct 21, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MULTICHIP PACKAGE
Publication number
20100244278
Publication date
Sep 30, 2010
CHIPMOS TECHNOLOGIES INC.
Geng Hsin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND THE METHOD THEREOF WITH ADHERING THE CHI...
Publication number
20100155916
Publication date
Jun 24, 2010
Geng-Shin SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip-Stacked Package Structure
Publication number
20100155929
Publication date
Jun 24, 2010
CHIPMOS TECHNOLOGY INC.
Chun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING PROCESS OF A CHIP PACKAGE STRUCTURE
Publication number
20100151624
Publication date
Jun 17, 2010
CHIPMOS TECHNOLOGIES INC.
Geng-Shin Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING QUAD FLAT NON-LEADED PACKAGE
Publication number
20100120201
Publication date
May 13, 2010
CHIPMOS TECHNOLOGIES INC.
Chun-Ying Lin
H01 - BASIC ELECTRIC ELEMENTS