Gengwei Jiang

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Lake Oswego, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for providing doped silicon using a diffusion barrier layer
- Patent number 12,125,705
- Issue date Oct 22, 2024
- Lam Research Corporation
- Purushottam Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal and silicon containing capping layers for interconnects
- Patent number 8,753,978
- Issue date Jun 17, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascaded cure approach to fabricate highly tensile silicon nitride...
- Patent number 8,512,818
- Issue date Aug 20, 2013
- Novellus Systems, Inc.
- Bhadri Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interfacial capping layers for interconnects
- Patent number 8,268,722
- Issue date Sep 18, 2012
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascaded cure approach to fabricate highly tensile silicon nitride...
- Patent number 8,211,510
- Issue date Jul 3, 2012
- Novellus Systems, Inc.
- Bhadri Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROVIDING DOPED SILICON USING A DIFFUSION BARRIER LAYER
- Publication number 20250046613
- Publication date Feb 6, 2025
- LAM RESEARCH CORPORATION
- Purushottam KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PROCESS CONTROL IN SEMICONDUCTOR MANUFACTURING
- Publication number 20220293442
- Publication date Sep 15, 2022
- LAM RESEARCH CORPORATION
- Purushottam Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING DOPED SILICON
- Publication number 20220165563
- Publication date May 26, 2022
- LAM RESEARCH CORPORATION
- Purushottam KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20140216336
- Publication date Aug 7, 2014
- Novellus Systems, Inc.
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL AND SILICON CONTAINING CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20130143401
- Publication date Jun 6, 2013
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL CAPPING LAYERS FOR INTERCONNECTS
- Publication number 20100308463
- Publication date Dec 9, 2010
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS