Geoffrey G. Tucker

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including topside cooling interfaces and me...
- Patent number 11,990,872
- Issue date May 21, 2024
- NXP USA, INC.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear impedance compensation system with microstrip and slotline c...
- Patent number 11,888,238
- Issue date Jan 30, 2024
- NXP USA, INC.
- Oleksandr Nikolayenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance compensation system with microstrip and slotline coupling...
- Patent number 11,322,844
- Issue date May 3, 2022
- NXP USA, INC.
- Oleksandr Nikolayenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Amplifier power combiner with slotline impedance transformer
- Patent number 10,826,437
- Issue date Nov 3, 2020
- NXP USA, INC.
- Oleksandr Nikolayenkov
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,785,862
- Issue date Sep 22, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,485,091
- Issue date Nov 19, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
- Patent number 10,431,449
- Issue date Oct 1, 2019
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic systems containing embedded heat dissipation struct...
- Patent number 10,141,182
- Issue date Nov 27, 2018
- NXP USA, INC.
- Jaynal A. Molla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules with sinter-bonded heat dissipation structu...
- Patent number 10,104,759
- Issue date Oct 16, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier with adjustable load
- Patent number 9,209,754
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20240291439
- Publication date Aug 29, 2024
- NXP USA, Inc.
- Geoffrey Tucker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR IMPEDANCE COMPENSATION SYSTEM WITH MICROSTRIP AND SLOTLINE C...
- Publication number 20210384627
- Publication date Dec 9, 2021
- Oleksandr Nikolayenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...
- Publication number 20210328552
- Publication date Oct 21, 2021
- NXP USA, Inc.
- Geoffrey Tucker
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
IMPEDANCE COMPENSATION SYSTEM WITH MICROSTRIP AND SLOTLINE COUPLING...
- Publication number 20200343636
- Publication date Oct 29, 2020
- NXP USA, Inc.
- Oleksandr Nikolayenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...
- Publication number 20190148138
- Publication date May 16, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER POWER COMBINER WITH SLOTLINE IMPEDANCE TRANSFORMER
- Publication number 20190115875
- Publication date Apr 18, 2019
- NXP USA, Inc.
- Oleksandr NIKOLAYENKOV
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20190098743
- Publication date Mar 28, 2019
- NXP USA, Inc.
- JAYNAL A. MOLLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20190021162
- Publication date Jan 17, 2019
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...
- Publication number 20180153030
- Publication date May 31, 2018
- NXP USA, Inc.
- LAKSHMINARAYAN VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AMPLIFIER WITH ADJUSTABLE LOAD
- Publication number 20150155838
- Publication date Jun 4, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Ramanujam Srinidhi Embar
- H03 - BASIC ELECTRONIC CIRCUITRY

Geoffrey G. Tucker

Person

Patents Grantslast 30 patents

Power amplifier modules including topside cooling interfaces and me...

Linear impedance compensation system with microstrip and slotline c...

Impedance compensation system with microstrip and slotline coupling...

Microelectronic components having integrated heat dissipation posts...

Amplifier power combiner with slotline impedance transformer

Microelectronic modules with sinter-bonded heat dissipation structu...

Microelectronic modules with sinter-bonded heat dissipation structu...

Microelectronic systems containing embedded heat dissipation struct...

Microelectronic components having integrated heat dissipation posts...

Microelectronic systems containing embedded heat dissipation struct...

Microelectronic modules with sinter-bonded heat dissipation structu...

Amplifier with adjustable load

Patents Applicationslast 30 patents

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

LINEAR IMPEDANCE COMPENSATION SYSTEM WITH MICROSTRIP AND SLOTLINE C...

POWER AMPLIFIER MODULES INCLUDING TOPSIDE COOLING INTERFACES AND ME...

IMPEDANCE COMPENSATION SYSTEM WITH MICROSTRIP AND SLOTLINE COUPLING...

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

MICROELECTRONIC SYSTEMS CONTAINING EMBEDDED HEAT DISSIPATION STRUCT...

AMPLIFIER POWER COMBINER WITH SLOTLINE IMPEDANCE TRANSFORMER

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTU...

AMPLIFIER WITH ADJUSTABLE LOAD