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Geol NAM

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
    • Publication number 20240145437
    • Publication date May 2, 2024
    • Samsung Electronics Co., Ltd.
    • JI-HWAN HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
    • Publication number 20230207533
    • Publication date Jun 29, 2023
    • Samsung Electronics Co., Ltd.
    • JI-HWAN HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220344271
    • Publication date Oct 27, 2022
    • Samsung Electronics Co., Ltd.
    • Geol NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220246582
    • Publication date Aug 4, 2022
    • Samsung Electronics Co., Ltd.
    • GEOL NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
    • Publication number 20210280564
    • Publication date Sep 9, 2021
    • Samsung Electronics Co., Ltd.
    • JI-HWAN HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210183821
    • Publication date Jun 17, 2021
    • Samsung Electronics Co., Ltd.
    • Taehyeong KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210159178
    • Publication date May 27, 2021
    • Samsung Electronics Co., Ltd.
    • Geol NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
    • Publication number 20200219853
    • Publication date Jul 9, 2020
    • Samsung Electronics Co., Ltd.
    • JI-HWAN HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20190378797
    • Publication date Dec 12, 2019
    • Samsung Electronics Co., Ltd.
    • Geol NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20190229091
    • Publication date Jul 25, 2019
    • Samsung Electronics Co., Ltd.
    • Taehyeong KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
    • Publication number 20190096856
    • Publication date Mar 28, 2019
    • Samsung Electronics Co., Ltd.
    • JI-HWAN HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20190013272
    • Publication date Jan 10, 2019
    • Samsung Electronics Co., Ltd.
    • Geol NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20180331076
    • Publication date Nov 15, 2018
    • Samsung Electronics Co., Ltd.
    • Sang-Sick PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20170243856
    • Publication date Aug 24, 2017
    • Sang-Sick PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
    • Publication number 20170243857
    • Publication date Aug 24, 2017
    • Samsung Electronics Co., Ltd.
    • JI-HWAN HWANG
    • H01 - BASIC ELECTRIC ELEMENTS