Georg Ernst

Person

Thalmassing, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor apparatus and method for producing a sensor apparatus
- Patent number 9,446,944
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Georg Ernst
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a back-bias magnet and a semiconductor chip element
- Patent number 9,164,156
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component and leadframe for producing the component
- Patent number 7,705,438
- Issue date Apr 27, 2010
- Infineon Technologies, AG
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for surface-mounted semiconductor devices
- Patent number 7,230,831
- Issue date Jun 12, 2007
- Infineon Technologies AG
- Uwe Luckner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for packing electronic components using injection molding te...
- Patent number 7,215,010
- Issue date May 8, 2007
- Infineon Technologies AG
- Ulrich Bast
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with electromagnetic shielding device
- Patent number 7,009,288
- Issue date Mar 7, 2006
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component with an integrated circuit mounted on an island...
- Patent number 6,870,245
- Issue date Mar 22, 2005
- Siemens Aktiengesellschaft
- Bernhard Schätzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a semiconductor chip on a semiconductor ch...
- Patent number 6,774,479
- Issue date Aug 10, 2004
- Infineon Technologies AG
- Bernhard Schätzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an integrated circuit and an integrated circuit
- Patent number 6,649,450
- Issue date Nov 18, 2003
- Infineon Technologies AG
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a chip carrier with openings for mak...
- Patent number 6,528,877
- Issue date Mar 4, 2003
- Infineon Technologies AG
- Georg Ernst
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SENSOR APPARATUS AND METHOD FOR PRODUCING A SENSOR APPARATUS
- Publication number 20150307344
- Publication date Oct 29, 2015
- INFINEON TECHNOLOGIES AG
- Georg ERNST
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS HAVING A BACK-BIAS MAGNET AND A SEMICONDUCTOR CHIP ELEMENT
- Publication number 20130082340
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
Heat sink for surface-mounted semiconductor devices
- Publication number 20060158857
- Publication date Jul 20, 2006
- Uwe Luckner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and leadframe for producing the component
- Publication number 20060151879
- Publication date Jul 13, 2006
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with electromagnetic shielding device
- Publication number 20050077596
- Publication date Apr 14, 2005
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having a semiconductor chip on a semiconductor ch...
- Publication number 20020192874
- Publication date Dec 19, 2002
- Bernhard Schatzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing an integrated circuit and an integrated circuit
- Publication number 20020079560
- Publication date Jun 27, 2002
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having a chip carrier with openings for mak...
- Publication number 20020041014
- Publication date Apr 11, 2002
- Georg Ernst
- H01 - BASIC ELECTRIC ELEMENTS

Georg Ernst

Person

Patents Grantslast 30 patents

Sensor apparatus and method for producing a sensor apparatus

Apparatus having a back-bias magnet and a semiconductor chip element

Electronic component and leadframe for producing the component

Heat sink for surface-mounted semiconductor devices

Device for packing electronic components using injection molding te...

Semiconductor component with electromagnetic shielding device

Electric component with an integrated circuit mounted on an island...

Electronic device having a semiconductor chip on a semiconductor ch...

Method of producing an integrated circuit and an integrated circuit

Semiconductor component having a chip carrier with openings for mak...

Patents Applicationslast 30 patents

SENSOR APPARATUS AND METHOD FOR PRODUCING A SENSOR APPARATUS

APPARATUS HAVING A BACK-BIAS MAGNET AND A SEMICONDUCTOR CHIP ELEMENT

Heat sink for surface-mounted semiconductor devices

Electronic component and leadframe for producing the component

Semiconductor component with electromagnetic shielding device

Electronic device having a semiconductor chip on a semiconductor ch...

Method of producing an integrated circuit and an integrated circuit

Semiconductor component having a chip carrier with openings for mak...