Georg J. Pietsch

Person

Burghausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wire saw, wire guide roll and method for simultaneously cutting a m...
- Patent number 11,878,359
- Issue date Jan 23, 2024
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for simultaneously cutting a multiplicity of slices of parti...
- Patent number 9,573,296
- Issue date Feb 21, 2017
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier, method for coating a carrier, and method for the simultane...
- Patent number 9,539,695
- Issue date Jan 10, 2017
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for simultaneously slicing a multiplicity of s...
- Patent number 9,346,188
- Issue date May 24, 2016
- Siltronic AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for simultaneously cutting a multiplicity of wafers from a w...
- Patent number 9,333,673
- Issue date May 10, 2016
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for buffer-storing a multiplicity of wafer-type w...
- Patent number 9,199,791
- Issue date Dec 1, 2015
- Siltronic AG
- Georg Pietsch
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method and apparatus for trimming the working layers of a double-si...
- Patent number 9,011,209
- Issue date Apr 21, 2015
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for trimming the working layers of a double-side grinding ap...
- Patent number 8,986,070
- Issue date Mar 24, 2015
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Insert carrier and method for the simultaneous double-side material...
- Patent number 8,974,267
- Issue date Mar 10, 2015
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for trimming the working layers of a double-side grinding ap...
- Patent number 8,911,281
- Issue date Dec 16, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the simultaneous double-side material-removing processin...
- Patent number 8,851,958
- Issue date Oct 7, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the simultaneous material-removing processing of both si...
- Patent number 8,801,500
- Issue date Aug 12, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for providing a respective flat working layer on each of the...
- Patent number 8,795,776
- Issue date Aug 5, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a semiconductor wafer
- Patent number 8,685,270
- Issue date Apr 1, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a substrate composed of semiconductor material
- Patent number 8,647,985
- Issue date Feb 11, 2014
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the simultaneous double-sided material removal processin...
- Patent number 8,512,099
- Issue date Aug 20, 2013
- Siltronic AG
- Michael Kerstan
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for producing and processing semiconductor wafers
- Patent number 8,398,878
- Issue date Mar 19, 2013
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the simultaneous grinding of a plurality of semiconducto...
- Patent number 8,113,913
- Issue date Feb 14, 2012
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer, apparatus and process for producing the semico...
- Patent number 7,867,059
- Issue date Jan 11, 2011
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method for the simultaneous double-side grinding of a plurality of...
- Patent number 7,815,489
- Issue date Oct 19, 2010
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer with improved local flatness, and method for it...
- Patent number 7,077,726
- Issue date Jul 18, 2006
- Siltronic AG
- Georg J. Pietsch
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing a semiconductor wafer which is coated on o...
- Patent number 6,051,498
- Issue date Apr 18, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Grant
Method and device for removing a semiconductor wafer from a flat su...
- Patent number 5,952,242
- Issue date Sep 14, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Georg Pietsch
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240136173
- Publication date Apr 25, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...
- Publication number 20230311363
- Publication date Oct 5, 2023
- SILTRONIC AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...
- Publication number 20230050459
- Publication date Feb 16, 2023
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...
- Publication number 20220234250
- Publication date Jul 28, 2022
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WIRE SAW, WIRE GUIDE ROLL AND METHOD FOR SIMULTANEOUSLY CUTTING A M...
- Publication number 20200016671
- Publication date Jan 16, 2020
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF SLICES OF PARTI...
- Publication number 20150314484
- Publication date Nov 5, 2015
- Siltronic AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF WAFERS FROM A W...
- Publication number 20150083104
- Publication date Mar 26, 2015
- Siltronic AG
- Georg Pietsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
- Publication number 20140170942
- Publication date Jun 19, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
- Publication number 20140170939
- Publication date Jun 19, 2014
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...
- Publication number 20130206126
- Publication date Aug 15, 2013
- Siltronic AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR THE SIMULTANEOUS DOUBLE-SIDE MATERIAL-REMOVING PROCESSIN...
- Publication number 20130072093
- Publication date Mar 21, 2013
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Device and Method For Buffer-Storing A Multiplicity of Wafer-Type W...
- Publication number 20130011227
- Publication date Jan 10, 2013
- Siltronic AG
- Georg Pietsch
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD FOR PROVIDING A RESPECTIVE FLAT WORKING LAYER ON EACH OF THE...
- Publication number 20120189777
- Publication date Jul 26, 2012
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
INSERT CARRIER AND METHOD FOR THE SIMULTANEOUS DOUBLE-SIDE MATERIAL...
- Publication number 20120190277
- Publication date Jul 26, 2012
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR THE SIMULTANEOUS MATERIAL-REMOVING PROCESSING OF BOTH SI...
- Publication number 20120156970
- Publication date Jun 21, 2012
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...
- Publication number 20120028546
- Publication date Feb 2, 2012
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20110133314
- Publication date Jun 9, 2011
- Siltronic AG
- Georg Pietsch
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR WAFER
- Publication number 20110097975
- Publication date Apr 28, 2011
- Siltronic AG
- Juergen SCHWANDNER
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR PRODUCING AND PROCESSING SEMICONDUCTOR WAFERS
- Publication number 20100323586
- Publication date Dec 23, 2010
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Device For The Double-Sided Processing Of Flat Workpieces and Metho...
- Publication number 20100099337
- Publication date Apr 22, 2010
- Siltronic AG
- Michael Kerstan
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor Wafer, Apparatus and Process For Producing The Semico...
- Publication number 20090203297
- Publication date Aug 13, 2009
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Carrier, Method For Coating A Carrier, and Method For The Simultane...
- Publication number 20090104852
- Publication date Apr 23, 2009
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Method For Polishing A Substrate Composed Of Semiconductor Material
- Publication number 20090029552
- Publication date Jan 29, 2009
- Siltronic AG
- Juergen Schwandner
- B24 - GRINDING POLISHING
Information Patent Application
Methods for the single-sided polishing of semiconductor wafers and...
- Publication number 20080265375
- Publication date Oct 30, 2008
- Siltronic AG
- Georg Pietsch
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method For The Simultaneous Grinding Of A Plurality Of Semiconducto...
- Publication number 20080233840
- Publication date Sep 25, 2008
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Method For The Simultaneous Double-Side Grinding Of A Plurality Of...
- Publication number 20080014839
- Publication date Jan 17, 2008
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer, apparatus and process for producing the semico...
- Publication number 20050173377
- Publication date Aug 11, 2005
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer with improved local flatness, and method for it...
- Publication number 20030060050
- Publication date Mar 27, 2003
- WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
- Georg J. Pietsch
- H01 - BASIC ELECTRIC ELEMENTS

Georg J. Pietsch

Person

Patents Grantslast 30 patents

Wire saw, wire guide roll and method for simultaneously cutting a m...

Method for simultaneously cutting a multiplicity of slices of parti...

Carrier, method for coating a carrier, and method for the simultane...

Apparatus and method for simultaneously slicing a multiplicity of s...

Method for simultaneously cutting a multiplicity of wafers from a w...

Device and method for buffer-storing a multiplicity of wafer-type w...

Method and apparatus for trimming the working layers of a double-si...

Method for trimming the working layers of a double-side grinding ap...

Insert carrier and method for the simultaneous double-side material...

Method for trimming the working layers of a double-side grinding ap...

Method for the simultaneous double-side material-removing processin...

Method for the simultaneous material-removing processing of both si...

Method for providing a respective flat working layer on each of the...

Method for producing a semiconductor wafer

Method for polishing a substrate composed of semiconductor material

Method for the simultaneous double-sided material removal processin...

Methods for producing and processing semiconductor wafers

Method for the simultaneous grinding of a plurality of semiconducto...

Semiconductor wafer, apparatus and process for producing the semico...

Method for the simultaneous double-side grinding of a plurality of...

Semiconductor wafer with improved local flatness, and method for it...

Method for manufacturing a semiconductor wafer which is coated on o...

Method and device for removing a semiconductor wafer from a flat su...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...

METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...

WIRE SAW, WIRE GUIDE ROLL AND METHOD FOR SIMULTANEOUSLY CUTTING A M...

METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF SLICES OF PARTI...

METHOD FOR SIMULTANEOUSLY CUTTING A MULTIPLICITY OF WAFERS FROM A W...

METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...

METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...

APPARATUS AND METHOD FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...

METHOD FOR THE SIMULTANEOUS DOUBLE-SIDE MATERIAL-REMOVING PROCESSIN...

Device and Method For Buffer-Storing A Multiplicity of Wafer-Type W...

METHOD FOR PROVIDING A RESPECTIVE FLAT WORKING LAYER ON EACH OF THE...

INSERT CARRIER AND METHOD FOR THE SIMULTANEOUS DOUBLE-SIDE MATERIAL...

METHOD FOR THE SIMULTANEOUS MATERIAL-REMOVING PROCESSING OF BOTH SI...

METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SI...

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHOD FOR PRODUCING A SEMICONDUCTOR WAFER

METHODS FOR PRODUCING AND PROCESSING SEMICONDUCTOR WAFERS

Device For The Double-Sided Processing Of Flat Workpieces and Metho...

Semiconductor Wafer, Apparatus and Process For Producing The Semico...

Carrier, Method For Coating A Carrier, and Method For The Simultane...

Method For Polishing A Substrate Composed Of Semiconductor Material

Methods for the single-sided polishing of semiconductor wafers and...

Method For The Simultaneous Grinding Of A Plurality Of Semiconducto...

Method For The Simultaneous Double-Side Grinding Of A Plurality Of...

Semiconductor wafer, apparatus and process for producing the semico...

Semiconductor wafer with improved local flatness, and method for it...