Georg Meyer-Berg

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 11,322,451
- Issue date May 3, 2022
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,233,027
- Issue date Jan 25, 2022
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an antenna
- Patent number 11,195,787
- Issue date Dec 7, 2021
- Infineon Technologies AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with cross-linked thermoplastic dielectric
- Patent number 10,854,547
- Issue date Dec 1, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,679,959
- Issue date Jun 9, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a product substrate and a bonded substrate system
- Patent number 10,600,690
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Georg Meyer-Berg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,678
- Issue date Jan 7, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die attach system and method
- Patent number 10,297,564
- Issue date May 21, 2019
- Infineon Technologies AG
- Joachim Mahler
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 10,211,158
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Attaching chip attach medium to already encapsulated electronic chip
- Patent number 10,177,112
- Issue date Jan 8, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component and semiconductor...
- Patent number 10,121,690
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interlocked connection
- Patent number 10,090,216
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for handling a product substrate, a bonded substrate system...
- Patent number 10,056,295
- Issue date Aug 21, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of multiple power semiconductor chips and method of man...
- Patent number 10,049,962
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for determining a state of a rechargeable battery or of a...
- Patent number 9,748,611
- Issue date Aug 29, 2017
- Infineon Technologies AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant
- Patent number 9,666,499
- Issue date May 30, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with interlocked connection
- Patent number 9,627,305
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Georg Meyer-Berg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device comprising a ductile layer and method of making the same
- Patent number 9,576,867
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and a method for manufacturing an integr...
- Patent number 9,425,116
- Issue date Aug 23, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with sheet-like redistribution structure
- Patent number 9,349,709
- Issue date May 24, 2016
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising a ductile layer and method of making the same
- Patent number 9,331,019
- Issue date May 3, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package and packaging methods
- Patent number 9,269,685
- Issue date Feb 23, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged nano-structured component and method of making a packaged...
- Patent number 9,249,014
- Issue date Feb 2, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package and packaging methods
- Patent number 9,236,362
- Issue date Jan 12, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with passives
- Patent number 9,190,389
- Issue date Nov 17, 2015
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220336399
- Publication date Oct 20, 2022
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20220148951
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220108966
- Publication date Apr 7, 2022
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266166
- Publication date Aug 20, 2020
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE
- Publication number 20190287907
- Publication date Sep 19, 2019
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20190221521
- Publication date Jul 18, 2019
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190123009
- Publication date Apr 25, 2019
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Attach System and Method
- Publication number 20190109112
- Publication date Apr 11, 2019
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling a Product Substrate and a Bonded Substrate System
- Publication number 20180350683
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
- Publication number 20170236776
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Ngoc-Hoa Huynh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Attaching chip attach medium to already encapsulated electronic chip
- Publication number 20170221857
- Publication date Aug 3, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package With Interlocked Connection
- Publication number 20170170082
- Publication date Jun 15, 2017
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MAN...
- Publication number 20160358886
- Publication date Dec 8, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Comprising a Ductile Layer and Method of Making the Same
- Publication number 20160218044
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling a Product Substrate, a Bonded Substrate System...
- Publication number 20160218039
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20160190044
- Publication date Jun 30, 2016
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor component and semiconductor...
- Publication number 20160181138
- Publication date Jun 23, 2016
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20160126192
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150200174
- Publication date Jul 16, 2015
- INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with sheet-like redistribution structure
- Publication number 20150155267
- Publication date Jun 4, 2015
- INFINEON TECHNOLOGIES AG
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution layer and method of forming a redistribution layer
- Publication number 20150115442
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Georg MEYER-BERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20150049443
- Publication date Feb 19, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Package with Passives
- Publication number 20150028487
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package with Embedded Passive Component
- Publication number 20150028448
- Publication date Jan 29, 2015
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH INTERLOCKED CONNECTION
- Publication number 20150014845
- Publication date Jan 15, 2015
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A...
- Publication number 20150004451
- Publication date Jan 1, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
Packaged Semiconductor Device
- Publication number 20140353808
- Publication date Dec 4, 2014
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS

Georg Meyer-Berg

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Power semiconductor module having a direct copper bonded substrate...

Semiconductor device

Semiconductor device including an antenna

Chip package with cross-linked thermoplastic dielectric

Metallic interconnect, a method of manufacturing a metallic interco...

Semiconductor device

Method for handling a product substrate and a bonded substrate system

Semiconductor device

Chip package and a wafer level package

Semiconductor die attach system and method

Power semiconductor module having a direct copper bonded substrate...

Attaching chip attach medium to already encapsulated electronic chip

Method of manufacturing a semiconductor component and semiconductor...

Semiconductor package with interlocked connection

Method for handling a product substrate, a bonded substrate system...

Arrangement of multiple power semiconductor chips and method of man...

Chip package and a wafer level package

Apparatus for determining a state of a rechargeable battery or of a...

Semiconductor device with encapsulant

Semiconductor module with interlocked connection

Device comprising a ductile layer and method of making the same

Integrated circuit package and a method for manufacturing an integr...

Electronic component with sheet-like redistribution structure

Device comprising a ductile layer and method of making the same

Integrated circuit package and packaging methods

Packaged nano-structured component and method of making a packaged...

Integrated circuit package and packaging methods

Chip package with passives

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA

SEMICONDUCTOR DEVICE

Method and Structure for Supporting Thin Semiconductor Chips with a...

SEMICONDUCTOR DEVICE

CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

SEMICONDUCTOR DEVICE

Semiconductor Die Attach System and Method

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

Method for Handling a Product Substrate and a Bonded Substrate System

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA

Attaching chip attach medium to already encapsulated electronic chip

Semiconductor Package With Interlocked Connection

ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MAN...

Device Comprising a Ductile Layer and Method of Making the Same

Method for Handling a Product Substrate, a Bonded Substrate System...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

Method of manufacturing a semiconductor component and semiconductor...

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

SEMICONDUCTOR DEVICE

Electronic component with sheet-like redistribution structure

Redistribution layer and method of forming a redistribution layer

CHIP ARRANGEMENT

Chip Package with Passives

Chip Package with Embedded Passive Component

SEMICONDUCTOR MODULE WITH INTERLOCKED CONNECTION

APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A...

Packaged Semiconductor Device