Georg Parteder

Follow

Person

AE EINDHOVEN, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Through-substrate via and method for manufacturing a through-substr...
- Patent number 12,211,769
- Issue date Jan 28, 2025
- ams AG
- Georg Parteder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a through-substrate via and a semiconductor devic...
- Patent number 11,764,109
- Issue date Sep 19, 2023
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-substrate via and its method of m...
- Patent number 11,404,352
- Issue date Aug 2, 2022
- AMSAG
- Victor Sidorov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-SUBSTRATE VIA AND METHOD FOR MANUFACTURING A THROUGH-SUBSTR...
- Publication number 20220328380
- Publication date Oct 13, 2022
- ams AG
- Georg PARTEDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE VIA AND A SEMICONDUCTOR DEVIC...
- Publication number 20210020511
- Publication date Jan 21, 2021
- ams AG
- Jochen Kraft
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND ITS METHOD OF M...
- Publication number 20210005534
- Publication date Jan 7, 2021
- ams AG
- Victor Sidorov
- H01 - BASIC ELECTRIC ELEMENTS