Georg Seidemann

Person

Landshut, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of 2XD module using high density interconnect bridges
- Patent number 12,125,815
- Issue date Oct 22, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to implement wafer-level chip-scale packages with grounded c...
- Patent number 12,080,655
- Issue date Sep 3, 2024
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief die implementation
- Patent number 12,057,411
- Issue date Aug 6, 2024
- Intel Corporation
- Stephan Stoeckl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
- Patent number 11,877,403
- Issue date Jan 16, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages, and methods for forming semiconductor packages
- Patent number 11,764,187
- Issue date Sep 19, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 11,735,570
- Issue date Aug 22, 2023
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing reduced height s...
- Patent number 11,469,213
- Issue date Oct 11, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic coils in locally thinned silicon bridges and methods of as...
- Patent number 11,456,116
- Issue date Sep 27, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure with internal conductive layer
- Patent number 11,424,209
- Issue date Aug 23, 2022
- Intel Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antennas stitched to systems in packages and methods of assem...
- Patent number 11,374,323
- Issue date Jun 28, 2022
- Intel Corporation
- Andreas Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 11,270,941
- Issue date Mar 8, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,239,199
- Issue date Feb 1, 2022
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical and lateral interconnects between dies
- Patent number 11,177,220
- Issue date Nov 16, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with angular deflections and wrapped printed wiring boar...
- Patent number 11,145,577
- Issue date Oct 12, 2021
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring-board islands for connecting chip packages and metho...
- Patent number 11,134,573
- Issue date Sep 28, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inductors
- Patent number 11,127,813
- Issue date Sep 21, 2021
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked die in a microelectronic device
- Patent number 11,107,763
- Issue date Aug 31, 2021
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing partial electrical shielding
- Patent number 11,081,541
- Issue date Aug 3, 2021
- Intel Corporation
- Veronica Sciriha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 11,031,699
- Issue date Jun 8, 2021
- Intel IP Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic silicon bridge stack including a hybrid baseband die sup...
- Patent number 11,018,114
- Issue date May 25, 2021
- Intel IP Corporation
- Bernd Waidhas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die package with more than one hanging die
- Patent number 10,854,590
- Issue date Dec 1, 2020
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages including an optical redistribution layer
- Patent number 10,816,742
- Issue date Oct 27, 2020
- Intel IP Corporation
- Georg Seidemann
- G02 - OPTICS
Information Patent Grant
Embedded-bridge substrate connectors and methods of assembling same
- Patent number 10,727,197
- Issue date Jul 28, 2020
- Intel IP Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package assemblies including a chip recess
- Patent number 10,714,455
- Issue date Jul 14, 2020
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing partial electrical shielding
- Patent number 10,700,159
- Issue date Jun 30, 2020
- Intel IP Corporation
- Veronica Sciriha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package structure with internal conductive layer
- Patent number 10,672,731
- Issue date Jun 2, 2020
- Intel IP Corporation
- Sven Albers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate for a semiconductor device and a method for formi...
- Patent number 10,658,201
- Issue date May 19, 2020
- Intel IP Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Routing and Passive Components in a Direct Bonding Layer
- Publication number 20250006630
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20240429221
- Publication date Dec 26, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...
- Publication number 20240429117
- Publication date Dec 26, 2024
- Intel Corporation
- Harshit DHAKAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20240405433
- Publication date Dec 5, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NAN...
- Publication number 20240364002
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STR...
- Publication number 20240364023
- Publication date Oct 31, 2024
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE WITH CAPACITIVE COUPLING
- Publication number 20240364000
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...
- Publication number 20240363567
- Publication date Oct 31, 2024
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
- Publication number 20240213225
- Publication date Jun 27, 2024
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
- Publication number 20240128202
- Publication date Apr 18, 2024
- Intel Corporation
- Gianni SIGNORINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES
- Publication number 20240128223
- Publication date Apr 18, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20230343766
- Publication date Oct 26, 2023
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR SEMICONDUCTOR DEVICES
- Publication number 20230317620
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING
- Publication number 20230317562
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
- Publication number 20230317582
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BRIDGE FOR CONNECTING DIES
- Publication number 20230317618
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
- Publication number 20230317621
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROOVED PACKAGE
- Publication number 20230317536
- Publication date Oct 5, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD
- Publication number 20230307313
- Publication date Sep 28, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE
- Publication number 20230197599
- Publication date Jun 22, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Die and Method for Forming a S...
- Publication number 20230197644
- Publication date Jun 22, 2023
- Intel Corporation
- Wolfgang MOLZER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANORIBBON-BASED CAPACITORS
- Publication number 20230187477
- Publication date Jun 15, 2023
- Intel Corporation
- Martin OSTERMAYR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRESHOLD VOLTAGE TUNING FOR NANORIBBON-BASED TRANSISTORS
- Publication number 20230163170
- Publication date May 25, 2023
- Intel Corporation
- Martin Ostermayr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIES AND DEVICES WITH COILS FOR INDUCTIVE COUPLING
- Publication number 20230101378
- Publication date Mar 30, 2023
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Dies and Devices with a Coil for Inductive Coupling
- Publication number 20230102133
- Publication date Mar 30, 2023
- Martin OSTERMAYR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Forming a Semiconductor Device
- Publication number 20230095162
- Publication date Mar 30, 2023
- Intel Corporation
- Georg SEIDEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415806
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS

Georg Seidemann

Person

Patents Grantslast 30 patents

Microelectronic assemblies having topside power delivery structures

Antenna with graded dielectirc and method of making the same

Assembly of 2XD module using high density interconnect bridges

Method to implement wafer-level chip-scale packages with grounded c...

Stress relief die implementation

Package stacking using chip to wafer bonding

Printed wiring-board islands for connecting chip packages and metho...

Semiconductor packages, and methods for forming semiconductor packages

Fan out packaging pop mechanical attach method

Systems, methods, and apparatuses for implementing reduced height s...

Magnetic coils in locally thinned silicon bridges and methods of as...

Wafer level package structure with internal conductive layer

Patch antennas stitched to systems in packages and methods of assem...

Bare-die smart bridge connected with copper pillars for system-in-p...

Package stacking using chip to wafer bonding

Vertical and lateral interconnects between dies

Lead frame with angular deflections and wrapped printed wiring boar...

Printed wiring-board islands for connecting chip packages and metho...

Semiconductor inductors

Interconnect structure for stacked die in a microelectronic device

Method of providing partial electrical shielding

Antenna with graded dielectirc and method of making the same

Monolithic silicon bridge stack including a hybrid baseband die sup...

Semiconductor die package with more than one hanging die

Integrated circuit packages including an optical redistribution layer

Embedded-bridge substrate connectors and methods of assembling same

Integrated circuit package assemblies including a chip recess

Method of providing partial electrical shielding

Wafer level package structure with internal conductive layer

Carrier substrate for a semiconductor device and a method for formi...

Patents Applicationslast 30 patents

Routing and Passive Components in a Direct Bonding Layer

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...

ANTENNA MODULES AND COMMUNICATION DEVICES

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

MILLIMETER WAVE ANTENNA ESD PROTECTION USING INTEGRATED POLYMER NAN...

SPHERICAL ANTENNA ARRANGEMENT WITH Z-DIMENSIONAL PLATED ANTENNA STR...

ANTENNA MODULE WITH CAPACITIVE COUPLING

RF ANTENNA MODULE USING COPPER-TO-COPPER INTERCONNECTS BETWEEN THE...

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

PACKAGE STACKING USING CHIP TO WAFER BONDING

METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...

ASSEMBLY OF 2XD MODULE USING HIGH DENSITY INTERCONNECT BRIDGES

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

INTERPOSERS FOR SEMICONDUCTOR DEVICES

THIN CLIENT FORM FACTOR ASSEMBLY

DUAL-SIDED TERMINAL DEVICE WITH SPLIT SIGNAL AND POWER ROUTING

GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION

GLASS BRIDGE FOR CONNECTING DIES

GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE

GROOVED PACKAGE

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE

Semiconductor Package, Semiconductor Die and Method for Forming a S...

NANORIBBON-BASED CAPACITORS

THRESHOLD VOLTAGE TUNING FOR NANORIBBON-BASED TRANSISTORS

SEMICONDUCTOR DIES AND DEVICES WITH COILS FOR INDUCTIVE COUPLING

Semiconductor Dies and Devices with a Coil for Inductive Coupling

Semiconductor Devices and Methods for Forming a Semiconductor Device

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES