George A. Bednarz

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Molded package for micromechanical devices and method of fabrication
- Patent number 7,026,710
- Issue date Apr 11, 2006
- Texas Instruments Incorporated
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a molded package for micromechanical devices
- Patent number 6,858,910
- Issue date Feb 22, 2005
- Texas Instruments Incorporated
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sproutless pre-packaged molding for component encapsulation
- Patent number 6,531,083
- Issue date Mar 11, 2003
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of fabricating a molded package for micromechanical devices
- Patent number 6,489,178
- Issue date Dec 3, 2002
- Texas Instruments Incorporated
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bellows container packaging system and method
- Patent number 6,071,457
- Issue date Jun 6, 2000
- Texas Instruments Incorporated
- George A. Bednarz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Pre-packaged liquid molding for component encapsulation
- Patent number 5,955,115
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sproutless pre-packaged molding for component encapsulation
- Patent number 5,912,024
- Issue date Jun 15, 1999
- Texas Instruments Incorporated
- Mario A. Bolanos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of making a post molded cavity package with internal dam bar...
- Patent number 5,106,784
- Issue date Apr 21, 1992
- Texas Instruments Incorporated
- George A. Bednarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of packaging a semiconductor device with reduced stress forces
- Patent number 4,874,722
- Issue date Oct 17, 1989
- Texas Instruments Incorporated
- George A. Bednarz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGE FOR MICROMECHANICAL DEVICES AND METHOD OF FABRICATION
- Publication number 20060006523
- Publication date Jan 12, 2006
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of fabricating a molded package for micromechanical devices
- Publication number 20030045025
- Publication date Mar 6, 2003
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of fabricating a molded package for micromechanical devices
- Publication number 20010034083
- Publication date Oct 25, 2001
- Anthony L. Coyle
- B81 - MICRO-STRUCTURAL TECHNOLOGY

George A. Bednarz

Person

Patents Grantslast 30 patents

Molded package for micromechanical devices and method of fabrication

Method of fabricating a molded package for micromechanical devices

Sproutless pre-packaged molding for component encapsulation

Method of fabricating a molded package for micromechanical devices

Bellows container packaging system and method

Pre-packaged liquid molding for component encapsulation

Sproutless pre-packaged molding for component encapsulation

Method of making a post molded cavity package with internal dam bar...

Process of packaging a semiconductor device with reduced stress forces

Patents Applicationslast 30 patents

MOLDED PACKAGE FOR MICROMECHANICAL DEVICES AND METHOD OF FABRICATION

Method of fabricating a molded package for micromechanical devices

Method of fabricating a molded package for micromechanical devices