George A. Katopis

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon carrier structure and method of forming same
- Patent number 8,295,056
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Reworkable electronic device assembly and method
- Patent number 8,227,264
- Issue date Jul 24, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method implementing short-pulse propagation technique on...
- Patent number 8,035,409
- Issue date Oct 11, 2011
- International Business Machines Corporation
- Alina Deutsch
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,985,927
- Issue date Jul 26, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkable electronic device assembly and method
- Patent number 7,936,060
- Issue date May 3, 2011
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,897,879
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit on a printed circuit board
- Patent number 7,742,315
- Issue date Jun 22, 2010
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate grid structure for the creation of virtual coax a...
- Patent number 7,465,882
- Issue date Dec 16, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and chip module
- Patent number 7,355,125
- Issue date Apr 8, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple power density chip structure
- Patent number 7,193,318
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dynamic bandwidth testing
- Patent number 5,970,052
- Issue date Oct 19, 1999
- International Business Machines Corporation
- Tin-Chee Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Early high level net based analysis of simultaneous switching
- Patent number 5,477,460
- Issue date Dec 19, 1995
- International Business Machines Corporation
- Charles K. Vakirtzis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
On-chip Delta-I noise clamping circuit
- Patent number 4,398,106
- Issue date Aug 9, 1983
- International Business Machines Corporation
- Evan E. Davidson
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
ADVANCED MODELING OF PRINTED CIRCUIT BOARD COSTS
- Publication number 20130024400
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Casimer M. DeCusatis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON CARRIER STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20120301977
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD
- Publication number 20110171756
- Publication date Jul 14, 2011
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carrier Structure and Method of Forming Same
- Publication number 20110019368
- Publication date Jan 27, 2011
- International Business Machines Corporation
- Paul Stephen Andry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SYSTEM AND METHOD IMPLEMENTING SHORT-PULSE PROPAGATION TECHNIQUE ON...
- Publication number 20100277197
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Alina Deutsch
- G01 - MEASURING TESTING
Information Patent Application
REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD
- Publication number 20100276796
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20090113703
- Publication date May 7, 2009
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20090108465
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...
- Publication number 20080142257
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and chip module
- Publication number 20070109726
- Publication date May 17, 2007
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit on a printed circuit board
- Publication number 20070111576
- Publication date May 17, 2007
- International Business Machines Corporation
- Wiren D. Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE POWER DENSITY CHIP STRUCTURE
- Publication number 20060038281
- Publication date Feb 23, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local reduction of compliant thermally conductive material layer th...
- Publication number 20050127500
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

George A. Katopis

Person

Patents Grantslast 30 patents

Silicon carrier structure and method of forming same

Reworkable electronic device assembly and method

System and method implementing short-pulse propagation technique on...

Ceramic substrate grid structure for the creation of virtual coax a...

Reworkable electronic device assembly and method

Ceramic substrate grid structure for the creation of virtual coax a...

Circuit on a printed circuit board

Ceramic substrate grid structure for the creation of virtual coax a...

Printed circuit board and chip module

Multiple power density chip structure

Method for dynamic bandwidth testing

Early high level net based analysis of simultaneous switching

On-chip Delta-I noise clamping circuit

Patents Applicationslast 30 patents

ADVANCED MODELING OF PRINTED CIRCUIT BOARD COSTS

SILICON CARRIER STRUCTURE AND METHOD OF FORMING SAME

REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD

Silicon Carrier Structure and Method of Forming Same

SYSTEM AND METHOD IMPLEMENTING SHORT-PULSE PROPAGATION TECHNIQUE ON...

REWORKABLE ELECTRONIC DEVICE ASSEMBLY AND METHOD

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

CERAMIC SUBSTRATE GRID STRUCTURE FOR THE CREATION OF VIRTUAL COAX A...

Printed circuit board and chip module

Circuit on a printed circuit board

MULTIPLE POWER DENSITY CHIP STRUCTURE

Local reduction of compliant thermally conductive material layer th...