George C. Anderson

Person

Sunrise, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for generating constant envelope modulation us...
- Patent number 7,864,882
- Issue date Jan 4, 2011
- Motorola Mobility, Inc.
- George C. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-mode communication device for generating constant envelope mo...
- Patent number 7,801,246
- Issue date Sep 21, 2010
- Motorola Mobility, Inc.
- George C. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat sink packaging assembly for electronic components
- Patent number 7,259,446
- Issue date Aug 21, 2007
- Motorola, Inc.
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio receiver providing reduced intermodulation distortion
- Patent number 5,564,094
- Issue date Oct 8, 1996
- Motorola, Inc.
- George C. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for making a semiconductor device with diamond heat dissipat...
- Patent number 5,508,230
- Issue date Apr 16, 1996
- Motorola, Inc.
- George F. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit assembly with improved heatsinking
- Patent number 5,388,027
- Issue date Feb 7, 1995
- Motorola, Inc.
- Randy L. Pollock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a substrate structure with improved heat dissipation
- Patent number 5,354,717
- Issue date Oct 11, 1994
- Motorola, Inc.
- Randy L. Pollock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for semiconductor devices
- Patent number 5,053,850
- Issue date Oct 1, 1991
- Motorola, Inc.
- Thomas R. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery saver circuit for a frequency synthesizer
- Patent number 4,955,075
- Issue date Sep 4, 1990
- Motorola, Inc.
- George C. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metallization means and method for high temperature applications
- Patent number 4,600,658
- Issue date Jul 15, 1986
- Motorola, Inc.
- George F. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization means and method for high temperature applications
- Patent number 4,495,222
- Issue date Jan 22, 1985
- Motorola, Inc.
- George F. Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR GENERATING CONSTANT ENVELOPE MODULATION US...
- Publication number 20080160933
- Publication date Jul 3, 2008
- MOTOROLA, INC.
- George C. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND DEVICE FOR GENERATING CONSTANT ENVELOPE MODULATION USING...
- Publication number 20080159418
- Publication date Jul 3, 2008
- MOTOROLA, INC.
- George C. Anderson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIVERSITY CONTROL OF MULTI-MODE COMMUNICATION DEVICES
- Publication number 20080146163
- Publication date Jun 19, 2008
- MOTOROLA, INC.
- Jose E. Korneluk
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SCALABLE INTERCHANGEABLE MULTIBAND POWER PACKAGE MOUNTING APPARATUS
- Publication number 20080079143
- Publication date Apr 3, 2008
- MOTOROLA, INC.
- Edmund B. Boucher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat sink packaging assembly for electronic components
- Publication number 20070045822
- Publication date Mar 1, 2007
- Jose Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless multimode communication with timed affiliation
- Publication number 20020072388
- Publication date Jun 13, 2002
- Jose E. Korneluk
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

George C. Anderson

Person

Patents Grantslast 30 patents

Method and apparatus for generating constant envelope modulation us...

Multi-mode communication device for generating constant envelope mo...

Heat sink packaging assembly for electronic components

Radio receiver providing reduced intermodulation distortion

Method for making a semiconductor device with diamond heat dissipat...

Electronic circuit assembly with improved heatsinking

Method for making a substrate structure with improved heat dissipation

Bonding pad for semiconductor devices

Battery saver circuit for a frequency synthesizer

Metallization means and method for high temperature applications

Metallization means and method for high temperature applications

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR GENERATING CONSTANT ENVELOPE MODULATION US...

METHOD AND DEVICE FOR GENERATING CONSTANT ENVELOPE MODULATION USING...

DIVERSITY CONTROL OF MULTI-MODE COMMUNICATION DEVICES

SCALABLE INTERCHANGEABLE MULTIBAND POWER PACKAGE MOUNTING APPARATUS

Heat sink packaging assembly for electronic components

Wireless multimode communication with timed affiliation