George Chu

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San Ramon, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level package and method
- Patent number 10,026,707
- Issue date Jul 17, 2018
- Microchip Technology Incorportated
- George Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGE AND METHOD
- Publication number 20180090460
- Publication date Mar 29, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- George Chu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR