George E. Zahr

Person

Wilmington, DE, US

People

Patents Grantslast 30 patents

Information Patent Grant
Film prepared from a casting composition comprising a polymer and s...
- Patent number 8,784,980
- Issue date Jul 22, 2014
- E I du Pont de Nemours and Company
- Pui-Yan Lin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board encapsulated by adhesive laminate comprising a...
- Patent number 8,663,804
- Issue date Mar 4, 2014
- E I du Pont de Nemours and Company
- George Elias Zahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for preparing substituted and unsubstituted diamino triazin...
- Patent number 8,586,734
- Issue date Nov 19, 2013
- E I du Pont de Nemours and Company
- George Elias Zahr
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Laminate comprising curable epoxy film layer comprising a di-isoimi...
- Patent number 8,580,386
- Issue date Nov 12, 2013
- E I du Pont de Nemours and Company
- George Elias Zahr
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable composition comprising a di-isoimide, method of curing, and...
- Patent number 8,536,170
- Issue date Sep 17, 2013
- E I du Pont de Nemours and Company
- George Elias Zahr
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-layer chip carrier and process for making
- Patent number 8,484,839
- Issue date Jul 16, 2013
- E I du Pont de Nemours and Company
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Di-isoimide composition
- Patent number 8,415,470
- Issue date Apr 9, 2013
- E I du Pont de Nemours and Company
- George Elias Zahr
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Composite of a polymer and surface modified hexagonal boron nitride...
- Patent number 8,288,466
- Issue date Oct 16, 2012
- E I du Pont de Nemours and Company
- Pui-Yan Lin
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Multi-layer chip carrier and process for making
- Patent number 8,163,381
- Issue date Apr 24, 2012
- E. I. Du Pont de Nemours and Company
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filled epoxy compositions
- Patent number 7,829,188
- Issue date Nov 9, 2010
- E. I. Du Pont de Nemours and Company
- Pui-Yan Lin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Printed circuits prepared from filled epoxy compositions
- Patent number 7,658,988
- Issue date Feb 9, 2010
- E. I. Du Pont de Nemours and Company
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyamic acid cross-linked polymer and formable composition therefrom
- Patent number 7,265,182
- Issue date Sep 4, 2007
- E. I. Du Pont de Nemours and Company
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide cross-linked polymer and shaped article thereof
- Patent number 7,265,181
- Issue date Sep 4, 2007
- E. I. Du Pont de Nemours and Company
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low loss dielectric material for printed circuit boards and integra...
- Patent number 6,890,635
- Issue date May 10, 2005
- E. I. Du Pont de Nemours and Company
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide chain extension process and functionalized polyamides pro...
- Patent number 6,866,930
- Issue date Mar 15, 2005
- INVISTA North America S.a.r.l.
- George E. Zahr
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide chain extension process and related polyamide product
- Patent number 6,504,004
- Issue date Jan 7, 2003
- E. I. Du Pont de Nemours and Company
- George E. Zahr
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process and product for making polyamides
- Patent number 6,277,948
- Issue date Aug 21, 2001
- E. I. Du Pont de Nemours and Company
- George Elias Zahr
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process and product for making polyamides
- Patent number 6,274,697
- Issue date Aug 14, 2001
- E. I. Du Pont de Nemours and Company
- George Elias Zahr
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of preparing bismuth oxide superconductor
- Patent number 5,840,660
- Issue date Nov 24, 1998
- E. I. Du Pont de Nemours and Company
- Munestugu Ueyama
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for dispersion spinning of sheathed rod-in-tube superconduct...
- Patent number 5,413,753
- Issue date May 9, 1995
- E. I. Du Pont de Nemours and Company
- George E. Zahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid composite comprising woven aramid fabrics coated with an adhe...
- Patent number 5,229,199
- Issue date Jul 20, 1993
- E. I. Du Pont de Nemours and Company
- Louis H. Miner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Microcrack resistant composites
- Patent number 4,803,101
- Issue date Feb 7, 1989
- E. I. Du Pont de Nemours and Company
- Beverly K. Roberts
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Filament-wound pressure vessel
- Patent number 4,767,017
- Issue date Aug 30, 1988
- E. I. Du Pont de Nemours and Company
- Francis M. Logullo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composites
- Patent number 4,678,821
- Issue date Jul 7, 1987
- E. I. Du Pont de Nemours and Company
- Francis M. Logullo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Film-forming poly(conjugated polymethine-type)dye
- Patent number 4,501,876
- Issue date Feb 26, 1985
- E. I. Du Pont de Nemours and Company
- George E. Zahr
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CURABLE COMPOSITION COMPRISING BIS-BENZOXAZINE, METHOD OF CURING, A...
- Publication number 20140073736
- Publication date Mar 13, 2014
- E I DU PONT NEMOURS AND COMPANY
- GEORGE ELIAS ZAHR
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTI-LAYER ARTICLE COMPRISING DISCRETE CONDUCTIVE PATHWAYS CONTACT...
- Publication number 20140069693
- Publication date Mar 13, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- GEORGE ELIAS ZAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ARTICLE COMPRISING A CURABLE COMPOSITION COMPRISING BIS-BENZ...
- Publication number 20140072800
- Publication date Mar 13, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- GEORGE ELIAS ZAHR
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PROCESS FOR PREPARING SUBSTITUTED AND UNSUBSTITUTED DIAMINO TRIAZIN...
- Publication number 20120330011
- Publication date Dec 27, 2012
- E.I. du Pont de Nemours and Company
- GEORGE ELIAS ZAHR
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LAMINATE COMPRISING CURABLE EPOXY FILM LAYER COMPRISING A DI-ISOIMI...
- Publication number 20120328874
- Publication date Dec 27, 2012
- E. I. du Pont de Nemours and Company
- GEORGE ELIAS ZAHR
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A...
- Publication number 20120325535
- Publication date Dec 27, 2012
- E.I. du Pont de Nemours and Company
- GEORGE ELIAS ZAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DI-ISOIMIDE COMPOSITION
- Publication number 20120330010
- Publication date Dec 27, 2012
- E.I. du Pont de Nemours and Company
- GEORGE ELIAS ZAHR
- C07 - ORGANIC CHEMISTRY
Information Patent Application
CURABLE COMPOSITION COMPRISING A DI-ISOIMIDE, METHOD OF CURING, AND...
- Publication number 20120329913
- Publication date Dec 27, 2012
- E.I. du Pont de Nemours and Company
- GEORGE ELIAS ZAHR
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING
- Publication number 20120178260
- Publication date Jul 12, 2012
- E I DU PONT DE NEMOURS AND COMPANY
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE OF A POLYMER AND SURFACE MODIFIED HEXAGONAL BORON NITRIDE...
- Publication number 20100288968
- Publication date Nov 18, 2010
- E. I. du Pont de Nemours and Company
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM PREPARED FROM A CASTING COMPOSITION COMPRISING A POLYMER AND S...
- Publication number 20100291365
- Publication date Nov 18, 2010
- E.I. du Pont de Nemours and Company
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING
- Publication number 20100065314
- Publication date Mar 18, 2010
- E.I. DuPont de Nemours and Company
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRIC DIELECTRIC FILM
- Publication number 20090110909
- Publication date Apr 30, 2009
- E.I. DuPont de Nemours and Company
- Jeffrey Glenn Innocenzo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Epoxy with low coefficient of thermal expansion
- Publication number 20070231581
- Publication date Oct 4, 2007
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed circuits prepared from filled epoxy compositions
- Publication number 20070231469
- Publication date Oct 4, 2007
- Pui-Yan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filled epoxy compositions
- Publication number 20070232727
- Publication date Oct 4, 2007
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polymide cross-linked polymer and shaped article thereof
- Publication number 20060041076
- Publication date Feb 23, 2006
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyamic acid cross-linked polymer and formable composition therefrom
- Publication number 20060020081
- Publication date Jan 26, 2006
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Low loss dielectric material for printed circuit boards and integra...
- Publication number 20040009727
- Publication date Jan 15, 2004
- Pui-Yan Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polyamide chain extension process and functionalized polyamides pro...
- Publication number 20020007041
- Publication date Jan 17, 2002
- George E Zahr
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
Polyamide chain extension process and related polyamide product
- Publication number 20020007040
- Publication date Jan 17, 2002
- George E Zahr
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING

George E. Zahr

Person

Patents Grantslast 30 patents

Film prepared from a casting composition comprising a polymer and s...

Printed wiring board encapsulated by adhesive laminate comprising a...

Process for preparing substituted and unsubstituted diamino triazin...

Laminate comprising curable epoxy film layer comprising a di-isoimi...

Curable composition comprising a di-isoimide, method of curing, and...

Multi-layer chip carrier and process for making

Di-isoimide composition

Composite of a polymer and surface modified hexagonal boron nitride...

Multi-layer chip carrier and process for making

Filled epoxy compositions

Printed circuits prepared from filled epoxy compositions

Polyamic acid cross-linked polymer and formable composition therefrom

Polyimide cross-linked polymer and shaped article thereof

Low loss dielectric material for printed circuit boards and integra...

Polyamide chain extension process and functionalized polyamides pro...

Polyamide chain extension process and related polyamide product

Process and product for making polyamides

Process and product for making polyamides

Method of preparing bismuth oxide superconductor

Method for dispersion spinning of sheathed rod-in-tube superconduct...

Rigid composite comprising woven aramid fabrics coated with an adhe...

Microcrack resistant composites

Filament-wound pressure vessel

Composites

Film-forming poly(conjugated polymethine-type)dye

Patents Applicationslast 30 patents

CURABLE COMPOSITION COMPRISING BIS-BENZOXAZINE, METHOD OF CURING, A...

MULTI-LAYER ARTICLE COMPRISING DISCRETE CONDUCTIVE PATHWAYS CONTACT...

COATED ARTICLE COMPRISING A CURABLE COMPOSITION COMPRISING BIS-BENZ...

PROCESS FOR PREPARING SUBSTITUTED AND UNSUBSTITUTED DIAMINO TRIAZIN...

LAMINATE COMPRISING CURABLE EPOXY FILM LAYER COMPRISING A DI-ISOIMI...

PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A...

DI-ISOIMIDE COMPOSITION

CURABLE COMPOSITION COMPRISING A DI-ISOIMIDE, METHOD OF CURING, AND...

MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING

COMPOSITE OF A POLYMER AND SURFACE MODIFIED HEXAGONAL BORON NITRIDE...

FILM PREPARED FROM A CASTING COMPOSITION COMPRISING A POLYMER AND S...

MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING

ASYMMETRIC DIELECTRIC FILM

Epoxy with low coefficient of thermal expansion

Printed circuits prepared from filled epoxy compositions

Filled epoxy compositions

Polymide cross-linked polymer and shaped article thereof

Polyamic acid cross-linked polymer and formable composition therefrom

Low loss dielectric material for printed circuit boards and integra...

Polyamide chain extension process and functionalized polyamides pro...

Polyamide chain extension process and related polyamide product