George Grama

Person

Orcutt, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride passivation layer for mercury cadmium telluride in...
- Patent number 11,851,785
- Issue date Dec 26, 2023
- Raytheon Company
- Andrew Clarke
- C30 - CRYSTAL GROWTH
Information Patent Grant
Integrating optical elements with electro-optical sensors via direc...
- Patent number 11,710,756
- Issue date Jul 25, 2023
- Raytheon Company
- Jamal I. Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 11,705,471
- Issue date Jul 18, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with aluminum nitride anti-deflection layer
- Patent number 11,410,937
- Issue date Aug 9, 2022
- Raytheon Company
- Andrew P. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of filling grooves and holes in a substrate
- Patent number 11,101,130
- Issue date Aug 24, 2021
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with anti-deflection layers
- Patent number 10,515,905
- Issue date Dec 24, 2019
- Raytheon Company
- Michael J. Rondon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 10,504,777
- Issue date Dec 10, 2019
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Acoustic wave device
- Patent number 9,209,380
- Issue date Dec 8, 2015
- TriQuint Semiconductor, Inc.
- Suzanne Combe
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave filter manufacturing method using photo-definable epo...
- Patent number 9,166,548
- Issue date Oct 20, 2015
- TriQuint Semiconductor, Inc.
- George Grama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave filters using photo-definable epoxy for suppression o...
- Patent number 7,800,281
- Issue date Sep 21, 2010
- Triquint Semiconductor, Inc.
- George Grama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level packaging of materials with different coefficients of t...
- Patent number 7,635,636
- Issue date Dec 22, 2009
- Triquint Semiconductor, Inc.
- Michael T. McClure
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of assembling a wafer-level package filter
- Patent number 7,596,849
- Issue date Oct 6, 2009
- Triquint Semiconductor, Inc.
- Charles Carpenter
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level packaging of materials with different coefficients of t...
- Patent number 7,109,635
- Issue date Sep 19, 2006
- Sawtek, Inc.
- Michael T. McClure
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20230282665
- Publication date Sep 7, 2023
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM NITRIDE PASSIVATION LAYER FOR MERCURY CADMIUM TELLURIDE IN...
- Publication number 20220372651
- Publication date Nov 24, 2022
- Raytheon Company
- Andrew Clarke
- C30 - CRYSTAL GROWTH
Information Patent Application
INTEGRATING OPTICAL ELEMENTS WITH ELECTRO-OPTICAL SENSORS VIA DIREC...
- Publication number 20220157881
- Publication date May 19, 2022
- Raytheon Company
- Jamal I. Mustafa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...
- Publication number 20220130883
- Publication date Apr 28, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ALUMINUM NITRIDE ANTI-DEFLECTION LAYER
- Publication number 20210280531
- Publication date Sep 9, 2021
- Raytheon Company
- Andrew P. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GROOVES AND HOLES IN A SUBSTRATE
- Publication number 20200211846
- Publication date Jul 2, 2020
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20200075396
- Publication date Mar 5, 2020
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANTI-DEFLECTION LAYERS
- Publication number 20190385954
- Publication date Dec 19, 2019
- Raytheon Company
- Michael J. Rondon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20190252244
- Publication date Aug 15, 2019
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ACOUSTIC WAVE DEVICE
- Publication number 20140252916
- Publication date Sep 11, 2014
- TriQuint Semiconductor, Inc.
- Suzanne Combe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD
- Publication number 20130087379
- Publication date Apr 11, 2013
- TriQuint Semiconductor, Inc.
- George Grama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package and Manufacturing Method Using Photodefinable P...
- Publication number 20120094418
- Publication date Apr 19, 2012
- TriQuint Semiconductor, Inc.
- George Grama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Level Packaging of Materials with Different Coefficents of Th...
- Publication number 20060263931
- Publication date Nov 23, 2006
- Michael T. McClure
- H03 - BASIC ELECTRONIC CIRCUITRY

George Grama

Person

Patents Grantslast 30 patents

Close butted collocated variable technology imaging arrays on a sin...

Aluminum nitride passivation layer for mercury cadmium telluride in...

Integrating optical elements with electro-optical sensors via direc...

Close butted collocated variable technology imaging arrays on a sin...

Semiconductor device with aluminum nitride anti-deflection layer

Method of manufacturing wafer level low melting temperature interco...

Method of filling grooves and holes in a substrate

Semiconductor device with anti-deflection layers

Method of manufacturing wafer level low melting temperature interco...

Acoustic wave device

Acoustic wave filter manufacturing method using photo-definable epo...

Acoustic wave filters using photo-definable epoxy for suppression o...

Wafer level packaging of materials with different coefficients of t...

Method of assembling a wafer-level package filter

Wafer level packaging of materials with different coefficients of t...

Patents Applicationslast 30 patents

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

ALUMINUM NITRIDE PASSIVATION LAYER FOR MERCURY CADMIUM TELLURIDE IN...

INTEGRATING OPTICAL ELEMENTS WITH ELECTRO-OPTICAL SENSORS VIA DIREC...

CLOSE BUTTED COLLOCATED VARIABLE TECHNOLOGY IMAGING ARRAYS ON A SIN...

SEMICONDUCTOR DEVICE WITH ALUMINUM NITRIDE ANTI-DEFLECTION LAYER

METHOD OF FILLING GROOVES AND HOLES IN A SUBSTRATE

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

SEMICONDUCTOR DEVICE WITH ANTI-DEFLECTION LAYERS

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

ACOUSTIC WAVE DEVICE

HIGH RELIABILITY WAFER LEVEL PACKAGE AND MANUFACTURING METHOD

Wafer Level Package and Manufacturing Method Using Photodefinable P...

Wafer Level Packaging of Materials with Different Coefficents of Th...