George H. Thiel

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to accommodate increase in volume expansion during solder re...
- Patent number 7,703,199
- Issue date Apr 27, 2010
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of accommodating in volume expansion during solder reflow
- Patent number 7,086,147
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for self healing cracks in underfill material...
- Patent number 7,045,562
- Issue date May 16, 2006
- International Business Machines Corporation
- George H. Thiel
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Non-planar surface for semiconductor chips
- Patent number 7,037,753
- Issue date May 2, 2006
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with semiconductor chips mounted thereon
- Patent number 6,967,389
- Issue date Nov 22, 2005
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module and method of manufacture of same
- Patent number 6,759,270
- Issue date Jul 6, 2004
- International Buisness Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module and method of manufacture of same
- Patent number 6,756,662
- Issue date Jun 29, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar surface for semiconductor chips
- Patent number 6,731,012
- Issue date May 4, 2004
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to accommodate increase in volume expansion during solder...
- Patent number 6,686,664
- Issue date Feb 3, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging a high performance chip
- Patent number 6,655,020
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative volume expansion lead-free electrical connection
- Patent number 6,649,833
- Issue date Nov 18, 2003
- International Business Machines Corporation
- David V. Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance chip packaging and method
- Patent number 6,552,264
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance chip packaging and method
- Patent number 6,552,266
- Issue date Apr 22, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal/electrical break for printed circuit boards
- Patent number 6,235,994
- Issue date May 22, 2001
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package
- Patent number 6,226,187
- Issue date May 1, 2001
- International Business Machines Corporation
- David Lee Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a heat sink and an adhesive
- Patent number 6,084,299
- Issue date Jul 4, 2000
- International Business Machines Corporation
- David Lee Questad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT EXCHANGER HAVING TEMPERATURE-ACTUATED VALVES
- Publication number 20090200007
- Publication date Aug 13, 2009
- Lockheed Martin Corporation
- Brian W. Foy
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20060208030
- Publication date Sep 21, 2006
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structure for self healing cracks in underfill material...
- Publication number 20050085564
- Publication date Apr 21, 2005
- International Business Machines Corporation
- George H. Thiel
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20040183094
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David Vincent Caletka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-planar surface for semiconductor chips
- Publication number 20040142508
- Publication date Jul 22, 2004
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer with semiconductor chips mounted thereon
- Publication number 20040135245
- Publication date Jul 15, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip module and method of manufacture of same
- Publication number 20040058474
- Publication date Mar 25, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MODULE AND METHOD OF MANUFACTURE OF SAME
- Publication number 20040056347
- Publication date Mar 25, 2004
- International Business Machines Corporation
- William Infantolino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure to accommodate increase in volume expansion during solder...
- Publication number 20020158110
- Publication date Oct 31, 2002
- International Business Machines Corporation
- David Vincent Caletka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE CHIP PACKAGING AND METHOD
- Publication number 20020053449
- Publication date May 9, 2002
- TIMOTHY F. CARDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance chip packaging and method
- Publication number 20010009196
- Publication date Jul 26, 2001
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance chip packaging and method
- Publication number 20010009197
- Publication date Jul 26, 2001
- Timothy F. Carden
- H01 - BASIC ELECTRIC ELEMENTS

George H. Thiel

Person

Patents Grantslast 30 patents

Method to accommodate increase in volume expansion during solder re...

Method of accommodating in volume expansion during solder reflow

Method and structure for self healing cracks in underfill material...

Non-planar surface for semiconductor chips

Wafer with semiconductor chips mounted thereon

Semiconductor chip module and method of manufacture of same

Semiconductor chip module and method of manufacture of same

Non-planar surface for semiconductor chips

Structure to accommodate increase in volume expansion during solder...

Method of packaging a high performance chip

Negative volume expansion lead-free electrical connection

High performance chip packaging and method

High performance chip packaging and method

Thermal/electrical break for printed circuit boards

Integrated circuit package

Integrated circuit package including a heat sink and an adhesive

Patents Applicationslast 30 patents

HEAT EXCHANGER HAVING TEMPERATURE-ACTUATED VALVES

Structure to accommodate increase in volume expansion during solder...

Method and structure for self healing cracks in underfill material...

Structure to accommodate increase in volume expansion during solder...

Non-planar surface for semiconductor chips

Wafer with semiconductor chips mounted thereon

Semiconductor chip module and method of manufacture of same

SEMICONDUCTOR CHIP MODULE AND METHOD OF MANUFACTURE OF SAME

Structure to accommodate increase in volume expansion during solder...

HIGH PERFORMANCE CHIP PACKAGING AND METHOD

High performance chip packaging and method

High performance chip packaging and method