George John Libricz, Jr.

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Bethlehem, PA, US

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Patents Grantslast 30 patents

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Packages for encapsulated semiconductor devices and method of makin...
- Patent number 7,956,451
- Issue date Jun 7, 2011
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having flexible leadframe
- Patent number 7,541,220
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with base features to reduce leakage
- Patent number 7,541,669
- Issue date Jun 2, 2009
- Agere Systems Inc.
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced leakage
- Patent number 7,224,047
- Issue date May 29, 2007
- LSI Corporation
- Patrick Joseph Carberry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having flexible leadframe
- Patent number 7,030,472
- Issue date Apr 18, 2006
- Agere Systems Inc.
- Timothy Brooks Bambridge
- H01 - BASIC ELECTRIC ELEMENTS