George P. Vakanas

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally-optimized tunable stack in cavity package-on-package
- Patent number 11,769,753
- Issue date Sep 26, 2023
- Intel Corporation
- George Vakanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laser-assisted chemical singulation of a wafer
- Patent number 8,426,250
- Issue date Apr 23, 2013
- Intel Corporation
- George Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an identification mark utilizing a liquid fil...
- Patent number 8,173,552
- Issue date May 8, 2012
- Intel Corporation
- George P. Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clipless integrated heat spreader process and materials
- Patent number 8,163,598
- Issue date Apr 24, 2012
- Intel Corporation
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipless integrated heat spreader process and materials
- Patent number 7,892,883
- Issue date Feb 22, 2011
- Intel Corporation
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabrication of passivated microfluidic str...
- Patent number 7,446,382
- Issue date Nov 4, 2008
- Intel Corporation
- Paul Winer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for fabrication of passivated microfluidic str...
- Patent number 6,878,567
- Issue date Apr 12, 2005
- Intel Corporation
- Paul Winer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CH...
- Publication number 20200098727
- Publication date Mar 26, 2020
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE
- Publication number 20200043894
- Publication date Feb 6, 2020
- Intel Corporation
- George VAKANAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN NIB OR COB CAPPING LAYER FOR NON-NOBLE METALLIC BONDING LANDIN...
- Publication number 20150247244
- Publication date Sep 3, 2015
- IMEC vzw
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Clipless Integrated Heat Spreader Process and Materials
- Publication number 20110129963
- Publication date Jun 2, 2011
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid film assisted laser die marking and structures formed thereby
- Publication number 20110031590
- Publication date Feb 10, 2011
- George P. Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER SINGULATION IN HIGH VOLUME MANUFACTURING
- Publication number 20100129984
- Publication date May 27, 2010
- George Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-assisted chemical singulation of a wafer
- Publication number 20100099238
- Publication date Apr 22, 2010
- George Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS
- Publication number 20090298235
- Publication date Dec 3, 2009
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for fabrication of passivated microfluidic str...
- Publication number 20050090034
- Publication date Apr 28, 2005
- Intel Corporation
- Paul Winer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microfluidic structures in a semiconductor substrate and method and...
- Publication number 20030003619
- Publication date Jan 2, 2003
- Paul Winer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

George P. Vakanas

Person

Patents Grantslast 30 patents

Thermally-optimized tunable stack in cavity package-on-package

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Laser-assisted chemical singulation of a wafer

Method of fabricating an identification mark utilizing a liquid fil...

Clipless integrated heat spreader process and materials

Clipless integrated heat spreader process and materials

Method and apparatus for fabrication of passivated microfluidic str...

Method and apparatus for fabrication of passivated microfluidic str...

Patents Applicationslast 30 patents

STACKED WIRE-BOND DICE ATTACHED BY PILLARS OR BUMPS ABOVE A FLIP-CH...

THERMALLY-OPTIMIZED TUNABLE STACK IN CAVITY PACKAGE-ON-PACKAGE

THIN NIB OR COB CAPPING LAYER FOR NON-NOBLE METALLIC BONDING LANDIN...

Clipless Integrated Heat Spreader Process and Materials

Liquid film assisted laser die marking and structures formed thereby

WAFER SINGULATION IN HIGH VOLUME MANUFACTURING

Laser-assisted chemical singulation of a wafer

CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS

Method and apparatus for fabrication of passivated microfluidic str...

Microfluidic structures in a semiconductor substrate and method and...