George S. Kostiew

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,943,931
- Issue date Apr 17, 2018
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,434,029
- Issue date Sep 6, 2016
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clipless integrated heat spreader process and materials
- Patent number 8,163,598
- Issue date Apr 24, 2012
- Intel Corporation
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipless integrated heat spreader process and materials
- Patent number 7,892,883
- Issue date Feb 22, 2011
- Intel Corporation
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE TCB BY DATA FEED FORWARD
- Publication number 20170154828
- Publication date Jun 1, 2017
- Intel Corporation
- Timothy A. GOSSELIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20170014957
- Publication date Jan 19, 2017
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20130299133
- Publication date Nov 14, 2013
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Clipless Integrated Heat Spreader Process and Materials
- Publication number 20110129963
- Publication date Jun 2, 2011
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS
- Publication number 20090298235
- Publication date Dec 3, 2009
- George Kostiew
- H01 - BASIC ELECTRIC ELEMENTS

George S. Kostiew

Person

Patents Grantslast 30 patents

Thermocompression bonding using plasma gas

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

Clipless integrated heat spreader process and materials

Clipless integrated heat spreader process and materials

Patents Applicationslast 30 patents

THERMOCOMPRESSION BONDING USING PLASMA GAS

ADAPTIVE TCB BY DATA FEED FORWARD

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

Clipless Integrated Heat Spreader Process and Materials

CLIPLESS INTEGRATED HEAT SPREADER PROCESS AND MATERIALS