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Gerald B. Feldewerth
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Phoenix, AZ, US
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last 30 patents
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Patent Grant
Under bump metallization layer to enable use of high tin content so...
Patent number
7,064,446
Issue date
Jun 20, 2006
Intel Corporation
John P. Barnak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anode and anode chamber for copper electroplating
Patent number
6,821,407
Issue date
Nov 23, 2004
Novellus Systems, Inc.
Jonathan D. Reid
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method of reducing sputtering burn-in time, minimizing sputtered pa...
Patent number
6,030,514
Issue date
Feb 29, 2000
Sony Corporation
John A. Dunlop
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
Method of manufacturing alloy sputtering targets
Publication number
20060137969
Publication date
Jun 29, 2006
Gerald B. Feldewerth
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Under bump metallization layer to enable use of high tin content so...
Publication number
20050250323
Publication date
Nov 10, 2005
John P. Barnak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDER BUMP METALLIZATION LAYER TO ENABLE USE OF HIGH TIN CONTENT SO...
Publication number
20050212133
Publication date
Sep 29, 2005
John P. Barnak
H01 - BASIC ELECTRIC ELEMENTS