Gerald Friese

Person

Muenchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
MIM capacitors with catalytic activation layer
- Patent number 7,843,035
- Issue date Nov 30, 2010
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of stress relief in semiconductor structures
- Patent number 7,786,007
- Issue date Aug 31, 2010
- Infineon Technologies AG
- Mark Hoinkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with a cap layer over the conductive plates
- Patent number 7,436,016
- Issue date Oct 14, 2008
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of stress relief in semiconductor structures
- Patent number 7,368,804
- Issue date May 6, 2008
- Infineon Technologies AG
- Mark Hoinkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-relief layer for semiconductor applications
- Patent number 6,960,835
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming MIM capacitors
- Patent number 6,949,442
- Issue date Sep 27, 2005
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced splattering of unpassivated laser fuses
- Patent number 6,872,648
- Issue date Mar 29, 2005
- Infineon Technologies AG
- Gerald R. Friese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure comprising tungsten or tungsten compound layer o...
- Patent number 6,866,943
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Gerald Friese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FBEOL process for Cu metallizations free from Al-wirebond pads
- Patent number 6,730,982
- Issue date May 4, 2004
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of eliminating back-end rerouting in ball grid array packaging
- Patent number 6,720,212
- Issue date Apr 13, 2004
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming fusible links
- Patent number 6,559,042
- Issue date May 6, 2003
- International Business Machines Corporation
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM Capacitors
- Publication number 20080290459
- Publication date Nov 27, 2008
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus of Stress Relief in Semiconductor Structures
- Publication number 20080213993
- Publication date Sep 4, 2008
- Mark Hoinkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM capacitors
- Publication number 20050282346
- Publication date Dec 22, 2005
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of stress relief in semiconductor structures
- Publication number 20050221610
- Publication date Oct 6, 2005
- Mark Hoinkis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress-relief layer for semiconductor applications
- Publication number 20050093159
- Publication date May 5, 2005
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single mask MIM capacitor top plate
- Publication number 20040224474
- Publication date Nov 11, 2004
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced splattering of unpassivated laser fuses
- Publication number 20040056322
- Publication date Mar 25, 2004
- Gerald R. Friese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE COMPRISING TUNGSTEN OR TUNGSTEN COMPOUND LAYER O...
- Publication number 20030203216
- Publication date Oct 30, 2003
- Infineon Technologies North America Corp.
- Gerald Friese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of eliminating back-end rerouting in ball grid array packaging
- Publication number 20030183913
- Publication date Oct 2, 2003
- Infineon Technologies North America Corp.
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming fusible links
- Publication number 20030003703
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power pads for application of high current per bond pad in silicon...
- Publication number 20020016070
- Publication date Feb 7, 2002
- Gerald Friese
- H01 - BASIC ELECTRIC ELEMENTS

Gerald Friese

Person

Patents Grantslast 30 patents

MIM capacitors with catalytic activation layer

Method and apparatus of stress relief in semiconductor structures

MIM capacitor with a cap layer over the conductive plates

Method and apparatus of stress relief in semiconductor structures

Stress-relief layer for semiconductor applications

Methods of forming MIM capacitors

Reduced splattering of unpassivated laser fuses

Bond pad structure comprising tungsten or tungsten compound layer o...

FBEOL process for Cu metallizations free from Al-wirebond pads

Method of eliminating back-end rerouting in ball grid array packaging

Process for forming fusible links

Patents Applicationslast 30 patents

MIM Capacitors

Method and Apparatus of Stress Relief in Semiconductor Structures

MIM capacitors

Method and apparatus of stress relief in semiconductor structures

Stress-relief layer for semiconductor applications

Single mask MIM capacitor top plate

Reduced splattering of unpassivated laser fuses

BOND PAD STRUCTURE COMPRISING TUNGSTEN OR TUNGSTEN COMPOUND LAYER O...

Method of eliminating back-end rerouting in ball grid array packaging

Process for forming fusible links

Power pads for application of high current per bond pad in silicon...