Gerald Lackner

Person

Arnoldstein, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer chuck for a laser beam wafer dicing equipment
- Patent number 12,205,842
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,848,237
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
- Patent number 11,712,749
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 11,637,028
- Issue date Apr 25, 2023
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,302,579
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 10,985,041
- Issue date Apr 20, 2021
- Infineon Technologies AG
- Thomas Fischer
- G01 - MEASURING TESTING
Information Patent Grant
Wafer arrangement and method for processing a wafer
- Patent number 10,777,444
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wafer, semiconductor device, electronic component and met...
- Patent number 10,672,664
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 10,186,438
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Thomas Fischer
- G01 - MEASURING TESTING
Information Patent Grant
Wafer arrangement and method for processing a wafer
- Patent number 9,966,293
- Issue date May 8, 2018
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with a front side and a back side metalliza...
- Patent number 9,177,893
- Issue date Nov 3, 2015
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component
- Patent number 8,993,372
- Issue date Mar 31, 2015
- Infineon Technologies Austria AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,865,522
- Issue date Oct 21, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus for holding and treatment of a substrate
- Patent number 8,857,805
- Issue date Oct 14, 2014
- Infineon Technologies AG
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus for holding and treatment of a substrate
- Patent number 8,822,310
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Gerald Lackner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,803,312
- Issue date Aug 12, 2014
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,546,934
- Issue date Oct 1, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a glass subst...
- Patent number 8,202,786
- Issue date Jun 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20230330769
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Use in Wafer Processing
- Publication number 20230170233
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT
- Publication number 20230100613
- Publication date Mar 30, 2023
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT
- Publication number 20230098233
- Publication date Mar 30, 2023
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
- Publication number 20220181211
- Publication date Jun 9, 2022
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Use in Wafer Processing
- Publication number 20210217640
- Publication date Jul 15, 2021
- INFINEON TECHNOLOGIES AG
- Thomas Fischer
- G01 - MEASURING TESTING
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20210053148
- Publication date Feb 25, 2021
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite Wafer, Semiconductor Device and Electronic Component
- Publication number 20200273750
- Publication date Aug 27, 2020
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Use in Wafer Processing
- Publication number 20190122909
- Publication date Apr 25, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Fischer
- G01 - MEASURING TESTING
Information Patent Application
Composite Wafer, Semiconductor Device, Electronic Component and Met...
- Publication number 20190088550
- Publication date Mar 21, 2019
- INFINEON TECHNOLOGIES AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER
- Publication number 20180261487
- Publication date Sep 13, 2018
- INFINEON TECHNOLOGIES AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Use in Wafer Processing
- Publication number 20170133253
- Publication date May 11, 2017
- INFINEON TECHNOLOGIES AG
- Thomas Fischer
- G01 - MEASURING TESTING
Information Patent Application
WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER
- Publication number 20160086838
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20140306327
- Publication date Oct 16, 2014
- INFINEON TECHNOLOGIES AG
- Hans-Joachim SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130328183
- Publication date Dec 12, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE
- Publication number 20130164939
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20120292757
- Publication date Nov 22, 2012
- INFINEON TECHNOLOGIES AG
- Anton MAUDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120248631
- Publication date Oct 4, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor component
- Publication number 20120225544
- Publication date Sep 6, 2012
- Manfred SCHNEEGANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...
- Publication number 20120012994
- Publication date Jan 19, 2012
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE
- Publication number 20090004824
- Publication date Jan 1, 2009
- INFINEON TECHNOLOGIES AG
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE
- Publication number 20080064184
- Publication date Mar 13, 2008
- Infineon Technologies AGAM CAMPEON
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS

Gerald Lackner

Person

Patents Grantslast 30 patents

Wafer chuck for a laser beam wafer dicing equipment

Method and apparatus for use in wafer processing

Composite wafer, semiconductor device and electronic component

Parent substrate, wafer composite and methods of manufacturing crys...

Method and apparatus for use in wafer processing

Composite wafer, semiconductor device and electronic component

Method and apparatus for use in wafer processing

Wafer arrangement and method for processing a wafer

Composite wafer, semiconductor device, electronic component and met...

Method and apparatus for use in wafer processing

Wafer arrangement and method for processing a wafer

Semiconductor component with a front side and a back side metalliza...

Method for producing a semiconductor component

Method for manufacturing semiconductor devices having a glass subst...

Method, apparatus for holding and treatment of a substrate

Method, apparatus for holding and treatment of a substrate

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Method for manufacturing semiconductor devices having a glass subst...

Patents Applicationslast 30 patents

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

Method and Apparatus for Use in Wafer Processing

WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT

WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT

Composite Wafer, Semiconductor Device and Electronic Component

Method and Apparatus for Use in Wafer Processing

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

Composite Wafer, Semiconductor Device and Electronic Component

Method and Apparatus for Use in Wafer Processing

Composite Wafer, Semiconductor Device, Electronic Component and Met...

WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER

Method and Apparatus for Use in Wafer Processing

WAFER ARRANGEMENT AND METHOD FOR PROCESSING A WAFER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING A SEMICONDUCTOR...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

Method for producing a semiconductor component

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS...

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE