Gerald Ofner

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device for radio frequency applications and method fo...
- Patent number 8,610,266
- Issue date Dec 17, 2013
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and a method for forming an integrated c...
- Patent number 8,357,565
- Issue date Jan 22, 2013
- Infinenon Technologies AG
- Gerald Ofner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 8,003,448
- Issue date Aug 23, 2011
- Infineon Technologies, AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for producing the same
- Patent number 7,816,235
- Issue date Oct 19, 2010
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with flip chip contacts and a passivation layer...
- Patent number 7,768,137
- Issue date Aug 3, 2010
- Infineon Technologies AG
- Gerald Ofner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with contact support layer and method to prod...
- Patent number 7,452,747
- Issue date Nov 18, 2008
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20100314721
- Publication date Dec 16, 2010
- INFINEON TECHNOLOGIES AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Perforated Substrate
- Publication number 20080150159
- Publication date Jun 26, 2008
- Irwin Aberin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated Circuit Package and a Method for Forming an Integrated C...
- Publication number 20080122053
- Publication date May 29, 2008
- Gerald Ofner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Producing the Same
- Publication number 20080006900
- Publication date Jan 10, 2008
- Infineon Technologies AG
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device for radio frequency applications and method fo...
- Publication number 20070075410
- Publication date Apr 5, 2007
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with contact support layer and method to prod...
- Publication number 20070037319
- Publication date Feb 15, 2007
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip with flip chip contacts, and method for producin...
- Publication number 20060270163
- Publication date Nov 30, 2006
- Gerald Ofner
- H01 - BASIC ELECTRIC ELEMENTS

Gerald Ofner

Person

Patents Grantslast 30 patents

Semiconductor device for radio frequency applications and method fo...

Integrated circuit package and a method for forming an integrated c...

Semiconductor package and method for producing the same

Semiconductor package and method for producing the same

Semiconductor chip with flip chip contacts and a passivation layer...

Semiconductor package with contact support layer and method to prod...

Patents Applicationslast 30 patents

Semiconductor Package and Method for Producing the Same

Semiconductor Package with Perforated Substrate

Integrated Circuit Package and a Method for Forming an Integrated C...

Semiconductor Package and Method for Producing the Same

Semiconductor device for radio frequency applications and method fo...

Semiconductor package with contact support layer and method to prod...

Semiconductor chip with flip chip contacts, and method for producin...