Gerald Peter Beyer

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Heverlee, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,141,284
- Issue date Nov 27, 2018
- Imec VZW
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20170301646
- Publication date Oct 19, 2017
- IMEC vzw
- Soon-Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS